Engineering Selection Summary: Selecting an industrial adhesive, potting compound, or thermal interface material (TIM) requires matching polymer backbone chemistry—2K Epoxy, 2K Addition-Cure Silicone, 2K Polyurethane (PU), 1K Moisture-Cure RTV Silicone, 1K Silane-Modified Polyether (SMP/MS), 2K Acrylic MMA (10:1), 1K UV/Dual-Cure Acrylate/Cationic Epoxy, or Anaerobic Methacrylate—to your substrate surface energy, coefficient of thermal expansion (CTE) mismatch, continuous operating temperature (-60°C to +250°C), and target thermal conductivity (0.75 to 25.0 W/(m·K)). Use the verified specification tables below to cross-reference Shanghai Jome Industrial Co., Ltd. (JOME) industrial grades by substrate pair, cure schedule, Shore hardness, and thermal dissipation.
1. Substrate & Chemistry Selection Matrix |
2. Thermal Potting, Gel, Grease & Pad Chart (0.75–25.0 W/m·K) |
3. Structural, UV, SMP & Anaerobic Grade Chart |
4. Interactive Potting Volume & Dosage Calculator |
5. Manufacturer Benchmark Guide
1. Master Substrate Pair, Peel/Shear & Polymer Chemistry Cross-Reference Matrix
Different industrial assemblies fail through distinct interfacial mechanisms: rigid epoxy resins excel in high lap-shear strength (18–28 MPa) on metals and thermoset composites but can crack fragile ceramic or glass components during -40°C to +150°C thermal shock unless toughened or replaced with low-modulus elastomeric silicones or polyurethanes. Low-surface-energy (LSE) polyolefins such as polypropylene (PP), polyethylene (PE), and PTFE fluoropolymers require surface activation or specialized primer chemistry before bonding.
| Primary Substrate Pair | Key Engineering Challenge | Recommended Polymer Chemistry | Reference JOME Grades | Typical Cure & Hardness / Strength | Primary Category Hub |
|---|---|---|---|---|---|
| Aluminum / Copper Cooling Plate to Battery Cell or Power Module | High heat flux dissipation, CTE mismatch between Al housing and Li-ion cells/PCBs, vibration resistance | 2K Thermally Conductive PU Structural Adhesive or 2K Dispense-in-Place Silicone Gap Filler | JOMP 2650A/B (1.3W), JOMG 1980 (8.0W), JOMS 1850-20A/B (2.0W) | RT or 60–80°C accelerated cure; Shore A 35 to Shore D 65; UL 94 V-0 flame retardancy | Thermally Conductive Adhesives |
| FR4 PCB, IGBT Ceramic (Al2O3/AlN) & Transformer Windings | High dielectric breakdown voltage (>18 kV/mm), low ionic impurity, low stress on solder joints & wire bonds | 2K Addition-Cure Silicone Gel / Potting or 2K Low-Viscosity Epoxy Potting | JOMS 5715A/B Gel, JOMS 5230-15 (1.5W), JOME 3113A/B (1.2W) | 1:1 or 10:1 mix ratio; self-healing gel (penetration 40–70 mm/10) to Shore D 82 epoxy | Potting & Encapsulating Compounds |
| NdFeB / Ferrite Permanent Magnets to Motor Rotor / Stator Steel | High-speed centrifugal shear at +150°C to +180°C, impact shock, oil/coolant immersion | 1K Heat-Cure Toughened Epoxy or Anaerobic Magnet Structural Adhesive | JOM 3107 Anaerobic, JOME 1767 1K Epoxy, JOME 2029A/B HT Epoxy | Anaerobic activator cure or 120–150°C heat cure; tensile shear >20 MPa on steel | Structural Adhesives |
| Engineering Plastics (ABS, PC, PA66, PBT, SMC/FRP Composites) | Rapid fixture without thermal distortion, high peel & impact resistance across large structural seams | 2K Acrylic MMA (10:1), 2K Polyurethane Structural, or 1K SMP/MS Hybrid | JOM 9138 (10:1 MMA), JOMP 2103A/B, JOMS 3360 SMP | 5–15 min working time (MMA); Shore D 70 (MMA) or elastic Shore A 45–55 (SMP) | MMA & PU Structural Adhesives |
| Low-Surface-Energy (LSE) Plastics (PP, PE, HDPE, PTFE, Santoprene) | Surface energy <32 dynes/cm prevents wetting and causes adhesive delamination without surface treatment | Polyolefin Adhesion Promoter + Acrylate/PU/Cyanoacrylate or Metal-Plastic Primer | JOM 1262 Primer + JOM 9138 / JOMP 2103A/B | 30–60 sec flash-off at RT; converts LSE surface for structural wet-out | Industrial Adhesion Primers |
| Optical Glass, Quartz, PMMA, PC Lenses & Medical Catheter Hubs | >98% light transmittance, non-yellowing, shadow-zone curing, low shrinkage (<1.5%) | 1K Optical Clear UV Acrylate, UV Cationic Epoxy, or Dual-Cure UV/Moisture Silicone | GM 3239 Optical UV, GM 3218, JM 2081 UV Epoxy, JM 3302 Dual-Cure | 365/405 nm UV LED cure in 3–15 seconds + secondary moisture/heat shadow cure | UV Curing Adhesives |
| Threaded Fasteners, Cylindrical Bearings, Gears & Hydraulic Pipe Threads | Vibration loosening, fretting corrosion, high-pressure oil/gas thread leakage | 1K Anaerobic Methacrylate or Dry-to-Touch Microcapsule Pre-Applied Threadlocker | JOM 263 / 277, JOM 638, JOM 567, JOM 204, JOM 93 | Fixture in 10–30 min on active metals; breakaway torque 20–42 N·m | Anaerobic Adhesives |
| Fuel, Aviation Kerosene, Transmission Oil & Harsh Solvent Enclosures | Standard silicone swells and degrades in hydrocarbon fuels, synthetic lubricants, and solvents | 1K / 2K Fluorosilicone Elastomer Sealant & Gel | JOMS 2125 (1K RTV Fluorosilicone), JOMS 1800 (2K Fluorosilicone) | -60°C to +200°C continuous; low volume swell in jet fuel, gasoline & mineral oil | Fluorosilicone Sealants |
2. Thermally Conductive Potting, Bonding, Gap Filler, Grease & Pad Specification Chart (0.75 – 25.0 W/m·K)
For EV battery packs, on-board chargers (OBC), DC-DC converters, solar string inverters, solid-state transformers (SST), and AI server cold plates, thermal resistance is governed by both bulk thermal conductivity (k, in W/(m·K)) and achievable bondline thickness (BLT). You can model exact temperature drop (ΔT) for any grade below using our Interactive Potting Volume & Thermal Impedance Calculator.
| JOME Model | Product Type & Polymer System | Thermal Conductivity | Mix Ratio / Form | Hardness / Rheology | Operating Temp & Key Compliance | Typical Target Applications |
|---|---|---|---|---|---|---|
| JOMP 2606 | 2K Polyurethane Potting Compound | 0.75 W/(m·K) | 2K Liquid (A:B) | Shore A 55–65, low viscosity self-leveling | -40°C to +120°C; UL 94 V-0; RoHS | Cost-effective EV/ESS BMS potting, outdoor LED drivers, sensor encapsulation |
| JOMS 5316 (5310 Series) | 1K Moisture-Cure RTV Silicone Adhesive Sealant | 0.82 W/(m·K) & 1.5 W/(m·K) | 1K Paste (No mixing) | Shore A 45–55 thixotropic paste | -50°C to +200°C; neutral dealcoholized | Power supply heatsink bonding, capacitor staking, PCB component fixation |
| JOME 3113A/B | 2K Thermally Conductive Epoxy Potting Compound | 1.2 W/(m·K) | 2K Liquid (A:B) | Shore D 80–85 rigid encapsulation | -40°C to +150°C; high dielectric strength | Motor stators, medium-frequency transformers, high-voltage coils, igniters |
| JOMP 2650A/B | 2K Thermally Conductive PU Structural Adhesive | 1.3 W/(m·K) | 2K Paste (1:1) | Shore D 60–70 structural bond | -40°C to +125°C; tensile shear >12 MPa | EV cell-to-pack (CTP) & cell-to-cooling-plate structural thermal bonding |
| JOMS 5230-15 (5230A/B) | 2K Addition-Cure Silicone Potting Compound | 1.5 W/(m·K) | 1:1 by weight | Shore A 45–55 soft elastic elastomer | -55°C to +200°C; UL 94 V-0; zero shrinkage | Automotive OBC, DC-DC converters, PV microinverters, ESS power modules |
| JOME 2040A/B | 2K Thermally Conductive Epoxy Potting Compound | 1.5 W/(m·K) | 2K Liquid (A:B) | Shore D 82–88 high-rigidity epoxy | -40°C to +160°C; chemical & moisture proof | Industrial servo motor encapsulation, automotive sensors, high-voltage potted reactors |
| JOMS 1850-20A/B | 2K High-Conductivity Silicone Potting Compound | 2.0 W/(m·K) | 1:1 by weight | Shore A 50–60 low-stress silicone | -55°C to +200°C; UL 94 V-0; low bleed | High-power EV chargers, solid-state transformers (SST), humanoid robot joint drives |
| JOMG 2340 | Thermally Conductive Structural Bonding Adhesive | 3.6 W/(m·K) | 1K / 2K Paste | Shore A 75–85 high-strength TIM bond | -50°C to +180°C; ultra-thin BLT capability | Copper-to-aluminum liquid-cooled plates, IGBT baseplates, CPU/GPU heatsinks |
| JOMG 2000 Series | Non-Curing Thermal Conductive Silicone Grease | 1.2 to 6.0 W/(m·K) | 1K Paste (Screen/Stencil) | Thixotropic non-flowing paste, low thermal impedance | -50°C to +200°C; low oil bleed, non-corrosive | IGBT modules, MOSFETs, CPU/server heat pipes, thermoelectric coolers |
| JOMG 1980 (Gel & Gap Filler) | 2K Dispense-in-Place Thermal Silicone Gel (Paste Variant) | 8.0 W/(m·K) | 1:1 Automated Dispensing | Shore 00 45–65 ultra-compliant gap filler | -55°C to +200°C; low compression force on PCBs | 5G base stations, optical transceivers, LiDAR modules, automotive domain controllers |
| TCMP 140# Series | Pre-Cured Solid Thermal Conductive Silicone Pad | 1.5 to 25.0 W/(m·K) | Die-Cut Sheet (0.5–5.0 mm) | Shore 00 30–70 compressible pad | -50°C to +200°C; UL 94 V-0; reworkable | High-density GPU/AI accelerators, battery pack cooling plates, power inverters |
3. Structural Bonding, UV Optical, SMP Hybrid Sealant & Anaerobic Fastener Specification Table
Beyond thermal management, JOME formulates complete structural and environmental sealing lines covering 1K/2K epoxies, 2K polyurethanes, 10:1 MMA structural acrylates, 1K low-VOC silane-modified polyether (SMP/MS) polymers, UV/dual-cure resins, and microcapsule pre-coated threadlockers.
| JOME Model | Chemistry & Cure System | Key Physical & Mechanical Specs | Primary Substrates | Typical Industrial Use Case |
|---|---|---|---|---|
| JOME Fast-Cure 2K | 2K Room-Temp Toughened Epoxy | High lap shear (>20 MPa), gap filling up to 3 mm, impact & chemical resistant | Metals, ferrites, ceramics, FRP/CFRP, hard plastics | General industrial metal-to-composite structural assembly & tooling |
| JOME 1767 / JOME 3665 | 1K Heat-Curing Epoxy Structural Adhesive | JOME 1767 (standard 120–150°C cure); JOME 3665 (low-temp 80–100°C cure); high Tg | Steel, aluminum, motor magnets, camera modules, sensors | Servo/traction motor magnet bonding, heat-sensitive electronic housings |
| JOME 2029A/B | 2K High-Temperature Structural Epoxy | Continuous service up to +180–200°C; high hot-strength retention | Stainless steel, aluminum, high-temp composites, ceramics | Aerospace brackets, high-speed turbine rotors, oilfield downhole sensors |
| JOME 8222 | 1K Thixotropic SMT Epoxy Red Glue | High dot profile retention, zero stringing, rapid heat cure during wave soldering | FR4 PCB, SMD passive components | High-speed dispensing & pin-transfer wave solder PCB assembly |
| JOM 9138 | 2K Methyl Methacrylate (MMA, 10:1) | Rapid fixture (5–15 min), minimal surface prep, high peel & impact strength | Aluminum, steel, ABS, PVC, SMC, fiberglass, gelcoats | Commercial vehicle body panels, rail transit interiors, marine hulls, wind nacelles |
| JOMP 2103A/B | 2K Polyurethane Structural Adhesive | Tough elastic bond, high elongation, absorbs differential thermal expansion | Painted metal, aluminum, CFRP/GFRP, polycarbonate, wood | Bus/truck roofs, HVAC enclosures, solar frame assembly, cleanroom panels |
| JOMS 3360 | 1K Silane-Modified Polyether (SMP / MS) | Isocyanate-free, solvent-free, low VOC, paintable, UV & weather resistant | Anodized aluminum, stainless steel, glass, coated panels | Rail car seam sealing, elevator panels, curtain walls, battery enclosure gaskets |
| JOMS 5322 / JOMS 5339 / JOMS 5928 | 2K Neutral-Cure Structural Silicone Sealants | Fast deep-section cure independent of humidity; high UV & weather durability | Photovoltaic glass, anodized aluminum frames, appliance doors | Solar PV frame & junction box sealing, automated appliance assembly lines |
| JM 3302 / JM 380 | UV / Dual-Cure CIPG Form-in-Place Gasket Resins | Rapid UV cure (seconds) + high compression recovery; replaces die-cut O-rings | Plastic & metal enclosures, automotive ECU housings, smart meters | Automated CIPG/FIPG waterproof sealing (IP67/IP68) replacing rubber gaskets |
| GM 4851 | 1K Peelable UV Temporary Masking Resin | Rapid UV cure; peels off cleanly in one piece with zero residue after processing | Glass, metal, sapphire, anodized aluminum, PCB gold fingers | Temporary protection during sandblasting, anodizing, PVD coating, wave soldering |
| JOMS 521 / JM 9000 / JOMP 410 | 1K Silicone Conformal Coating / UV & PU Thin-Layer Encapsulants | Moisture, salt-spray, sulfur & fungus barrier; UV trace inspection compatibility | Assembled PCBs, outdoor LED strips, marine & automotive PCBA | Conformal coating & thin-layer waterproof encapsulation of electronic boards |
| JOM 263/277 · JOM 638 · JOM 567 · JOM 204 · JOM 80 · JOM 93 · JOM 625 | Liquid Anaerobic & Pre-Applied Microcapsule Threadlockers / Sealants | High-strength bolt locking (263/277), slip-fit retaining (638), PTFE pipe seal (567), dry pre-applied film (204/80/93/625) | Steel, brass, stainless steel, plated fasteners, bearings, shafts | Automotive chassis bolts, robot harmonic drives, hydraulic fittings, mass-precoated screws |
Frequently Asked Engineering Questions (Selection & Qualification)
How do I choose between silicone, polyurethane, and epoxy potting compounds?
Choose 2K Silicone Potting (JOMS 5230-15, JOMS 1850-20A/B) when your assembly experiences wide thermal cycling (-55°C to +200°C) or contains delicate SMD components and wire bonds that require low modulus (Shore A 45–60) and repairability. Choose 2K Polyurethane Potting (JOMP 2606, JOMP 410) for tough, moisture-resistant encapsulation up to +120°C with strong adhesion to plastic housings. Choose 2K Epoxy Potting (JOME 3113A/B, JOME 2040A/B) when maximum mechanical rigidity (Shore D 80+), chemical/solvent resistance, and high-voltage coil insulation are required.
When should I use an 8.0 W/(m·K) two-part thermal gel (JOMG 1980) instead of a pre-cured thermal pad (TCMP 140#)?
Two-component dispense-in-place thermal gel (JOMG 1980, 8.0 W/m·K) wets out variable height tolerances (0.2–4.0 mm) across multiple components with near-zero assembly compression stress on fragile BGA/PCB packages and eliminates die-cutting inventory. Solid thermal pads (TCMP 140#, 1.5–25.0 W/m·K) are preferred when field disassembly without residue or ultra-high conductivity (12–25 W/m·K) on flat heatsink interfaces is required.
Can JOME customize viscosity, thixotropic index, pot life, or thermal conductivity for our automated dispensing line?
Yes. Shanghai Jome Industrial Co., Ltd. operates an in-house formulation and testing laboratory. We routinely adjust A/B viscosity, thixotropic index, open working time, cure speed, color, and filler loading to match your meter-mix dispensing equipment and substrate pair.
Need a TDS, SDS, or Sample Matched to Your Substrate & Thermal Target?
No formal engineering drawing required. Simply send your substrate pair, operating temperature / thermal conductivity target, or existing grade code—our R&D engineers respond within 24 hours with a matched JOME specification and trial sample plan.
WhatsApp Engineer (+86 13371933793)
Email: sales@jomebond.com
Related Engineering Resources: Potting Volume & Dosage Calculator · Manufacturer Comparison Guide · Full Product Catalog
Request free sample
-Speak with our material engineer
WhatsApp +86 18918756805
Matched JOME Industrial Formulations: For production bonding, potting, and sealing qualification in this application, evaluate 2K Thermal conductive epoxy potting compound（1.5W）, Thermal Conductive Polyurethane Potting Compound (1.3W), Thermal insulation polyurethane structural bonding adhesive（2.0W）, and Thermal conductive single-component RTV silicone adhesive（0.82W and 1.5W） (ISO 9001:2015 and CTI RoHS 2.0 verified; free engineering samples shipped via UPS freight collect).
Frequently Asked Engineering Questions
Q: How do I choose between silicone, polyurethane, and epoxy potting compounds?
Choose 2K Silicone Potting (JOMS 5230-15, JOMS 1850-20A/B) for wide thermal cycling (-55°C to +200°C), low stress on SMD components, and repairability. Choose 2K Polyurethane Potting (JOMP 2606, JOMP 410) for tough moisture resistance up to +120°C and strong plastic adhesion. Choose 2K Epoxy Potting (JOME 3113A/B, JOME 2040A/B) for high rigidity (Shore D 80+), chemical resistance, and high-voltage coil insulation.
Q: When should I use an 8.0 W/(m·K) two-part thermal gel (JOMG 1980) instead of a pre-cured thermal pad (TCMP 140#)?
Two-component dispense-in-place thermal gel (JOMG 1980, 8.0 W/m·K) wets out variable height tolerances (0.2–4.0 mm) with near-zero compression stress on fragile PCBs and eliminates die-cutting inventory. Solid thermal pads (TCMP 140#, 1.5–25.0 W/m·K) are preferred when residue-free disassembly or ultra-high conductivity (12–25 W/m·K) on flat heatsink interfaces is required.
Q: Can JOME customize viscosity, thixotropic index, pot life, or thermal conductivity for our automated dispensing line?
Yes. Shanghai Jome Industrial Co., Ltd. operates an in-house RandD laboratory that adjusts A/B viscosity, thixotropic index, open working time, cure speed, color, and filler loading to match your meter-mix dispensing equipment and substrate pair.
Industrial Adhesive Categories, Matched Grades and Engineering Guides
Product and Application Categories: Thermal Conductive Potting Compound · Thermal Conductive Silicone Gel Compound · Potting & Encapsulating Compound · Polyurethane Potting Compound · Epoxy Structural Adhesive · MMA Structural Bonding Adhesive · UV Structural Adhesive · PU Sealants · Fluorinated Sealants · Acrylic UV Adhesive · Dual Cure UV Hybrid Adhesives · Pre-coated thread sealant · Anaerobic structural adhesive · Waterproof Coating · Epoxy · Primer · Fluoro Silicone Gel Compound · Industries Guides · Automotive & New Energy Vehicles Guides · General Machinery Guides · Mass Transit Guides · Aerospace Guides
Matched Industrial Adhesives: Thermal Conductive potting Silicone Compound(0.75W) · High-temperature resistant lubricating grease · UV Curable Adhesive & Light Cure Adhesive · Screen Printing Silicone Ink for Fabric · 2-Part Clear epoxy adhesive thin layer Potting Compound · thermal conductive silicone grease（0.5-10 W/m.K ） · High bonding strength Optical transparent UV adhesive · 2-part Acrylic Structural Bonding Adhesive（MMA） · Metal, magnetically bonded Anaerobic Structural Adhesive · 2K Thermal conductive epoxy potting compound（1.5W） · UV-curable epoxy-based adhesive · 263 、277 Thread Locking Adhesive Prevents Bolts From Coming Loose · Thermal Conductive Polyurethane Potting Compound (1.3W) · Thermal conductive single-component RTV silicone adhesive（2.85W ） · High resilience UV glue replaces silicone rubber sealing ring · Clear self-repairing encapsulating silicone gel · Single-component low-temperature heat-curing epoxy structural adhesive · Temporary shielding material – Removable UV blue adhesive · Two-component paste-shaped thermal conductive silicone gel (8.0 W/mK)
Technical Application Guides: Epoxy Resin vs Polyurethane vs Acrylic vs Silicone Structural Adhesive: A Comparative Table of Main Types and Characteristics of Structural Bonding Adhesives · Can epoxy adhesive still cure in winter? · 40% of joint motor failures are attributable to the selection of potting compound · Requirements for adhesives used in medical-grade anesthesia masks · What type of adhesive is used for the joints and motors of humanoid robots? · How do you select semiconductor underfill? · Adhesive Manufacturer & Supplier for Robot Manufacturing & Assembly · PP PE Adhesive: Bonding Low-Surface-Energy Plastics · LOCA Glue: Liquid Optical Clear Adhesive for Display Bonding · Advanced Adhesive & Sealing Solutions for New Energy Lithium Battery Pack Housings · Advanced Thermal Interface Materials (TIM) and LED Power Supply Potting Solutions · An Overview of Types of Electronic Adhesives and Their Innovative Applications · The Most Comprehensive Classification of Adhesives in History · The Three Key Factors Affecting Adhesive Curing · Mobile Phone Adhesive Cross-Module Factory Inspection Guide: 6 Modules, 6 Types of Adhesives, 6 Inspection Methods · What is the function of a surface treatment agent? · Which adhesive should be used for bonding TPU and EVA? · What kind of adhesive is used in the tape that can directly "seal silicone"? · Are there any environmentally friendly, odorless coating adhesives available on the market? · A Brief Analysis of Commonly Used UV-Resistant Encapsulation Resin/UV-Resistant Encapsulation Paint · Mass Production of Photopolymerization Molding: Overview of SLA, DLP, and LCD Solutions · Complete Adhesive Application Solution for In-Vehicle Electronic Control Systems (Automotive-Grade) · Adhesive Application Protocol for Disposable Medical Catheters / Needles · Gel solution for complete wind turbine components – Wind turbine blades (land-based wind power + offshore wind power) · Bolt Thread Anti-Loosening & Sealing · The adhesive application schemes for various components of electronic equipment in new energy vehicles · Introduction to Different Adhesive Schemes for Various Industrial Sensors · Adhesive solutions for LED and LED-related products · String inverter adhesive application point · Fastener Bolt Anti-Loosening & Hardware Adhesive Application Solution · NEV Adhesive Application Map | Motor · Battery · Electronics · Body” · The 5 Core Performance Requirements for Heavy Equipment Adhesives · Full Adhesive Solution for Railway Transportation Industry