Thermal conductive single-component RTV silicone adhesive(2.85W )

JOMS 5928 is a hygroscopic, curable, neutral, alcohol-free silicone gel that incorporates special heat-conductive materials. Its thermal conductivity reaches up to 2.85 W/m.K. After curing, it forms a flexible rubber-like substance, fully meeting the requirements of the EU ROHS standard.
It is suitable for sealing LED lights; heat dissipation of automotive electronic components; thermal management and sealing of PCB boards and electronic components.
It is used to fill the gaps between high-power transistors, thyristor components, diodes and substrates (aluminum or copper).

product details

Thermal conductivity  RTV JOMS 5928 series bonding and sealing adhesive

Product description

JOMS 5928 is a moisture-absorbing , cureable neutral alcohol-free silicone gel enhanced with specialized thermal  conductive  materials,  which  forms  a  flexible  rubber-like  substance  upon  curing  and  fully  complies with EU ROHS requirements . During curing , it releases alcohols that are non-corrosive to polycarbonate (PC) , copper,  and  most  other  materials,  providing  excellent  adhesion  and  sealing  performance  to  ensure  stable protection for electronic devices under harsh conditions .

JOMS 5928 silicone adhesive sealant exhibits the following properties as a cured elastomer:

Has a high thermal conductivity

The  coating  layer  is  elastic ,  free  from  yellowing  or  oil  penetration ,  and  exhibits  excellent  overall performance .

Resists moisture , contaminants, and other atmospheric components

Reduce mechanical stress and tension caused by mechanical, thermal shock, and vibration .

Exhibits excellent electrical insulation properties and corona resistance .

Stable mechanical and electrical properties between -60 and 200 °C

Exhibits excellent outdoor aging resistance with a service life of up to 20–30 years .Application fields

Sealing  of LED  lamps; heat dissipation  for  automotive  electronic  components; thermal management and sealing for PCB boards and electronic components .

Filling the  gap  between  high-power  transistors,  thyristor  components,  diodes ,  and  the  substrate (aluminum or copper) .

Technical parameters before and after curing:

test item testing standard unit JOMS 5928
Pre-curing properties
pigment visualization  

white
viscosity GB/T 2794-2013 25℃ , mPa ·s The paste is nearly collapsed.
density GB/T 15223- 1994 25℃ , g/cm3 3. 1
Surface drying time GB/T13477 .5-2002 25℃ , 55%RH,min 5- 10
Properties after curing
hardness GB/T 531-2008 Shore A 70 ± 5
thermal

conductivity

GB/T 10297- 1998 W/m .K 2.85
Tensile elongation at break GB/T 528- 1998 % > 15
tensile strength GB/T 528-2009 MPa ≥1.0
shear strength GB/T 7124-2008 MPa, iron/iron ≥1.2
dielectric strength GB/T 1695-2005 kV/mm(25℃) > 10
Loss Factor GB/T 1693-2007 (1MHz) (25℃) 0.09
dielectric constant GB/T 1693-2007 (0.5 MHz) (25℃) 5.7
volume resistivity GB/T 1692-92 (DC500V) Ω · cm 1.00E +11

packing specifications:

JOMS5928,   300 ml per vial; 25 vials per box.

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