Single-component silicon-based thermal conductive gel (14 W/m-K)
TCMP140# Thermal Conductive Gel is a highly moldable silicone-based thermal conductive product with a clay-like consistency that resists flow and delamination while exhibiting excellent surface wettability. It achieves minimum leveling gaps as thin as 0.15mm and can be processed into high-compression sheet products or hand-molded rubber clay forms according to customer requirements. This material delivers superior thermal conductivity and exceptional joint-filling performance, fully compliant with UL 94V-0 standards.
It is applied to 5G communication boards, smart phone modules, electric control systems of new energy vehicles, optical modules, etc. It is particularly suitable for production lines that require long-term stable operation and support for automated mass production.
product details
TCMP 140# Thermal Conductive Gel
product description
TCMP140# Thermal Conductive Gel is a highly moldable silicone-based thermal conductive product with a clay-like consistency that resists flow and delamination while exhibiting excellent surface wettability. It achieves minimum leveling gaps as thin as 0.15mm and can be processed into high-compression sheet products or hand-molded rubber clay forms according to customer requirements. This material delivers superior thermal conductivity and exceptional joint-filling performance, fully compliant with UL 94V-0 standards.
| attribute | test method | TCMP 140# |
| pigment | visualization | white |
| constituent part | — | Silicone resin + Ceramic powder |
| Density (g/cc) | ASTM D792 | 5.1 |
| Extrusion properties (2.0 mm needle, 0.45 MPa air pressure) (g/min) | ISO 9048 | 10 |
| Temperature range (°C) | — | -50~200 |
| Volatile matter (% at 200°C for 24 hours) | HG/T 2502 | <0.5 |
| Oil separation degree (% at 200°C for 24 hours) | HG/T 2502 | <0.1 |
| Breakdown voltage (kV/mm) | ASTM D149 | ≥ 8.0 |
| Volume resistivity (Ω·cm) | ASTM D257 | 109 |
| Dielectric constant @ 10 MHz | ASTM D150 | 7.8 |
| fire-protection rating | UL 94 | V0 |
| Thermal conductivity (W/m-K) | ASTM D5470 | 14 |
| Thermal resistance (°C·in²/W) 0.3 mm @50 psi | ASTM D5470 | 0.08 |
| Low molecular weight content, ppm | ASTM D5470 | 20 |
| BLT minimum fill thickness, μm | — | 150 |
Characteristics and Advantages
thermal conductivity: 14 W/m·K (optional) High Electrical Insulation，High compression, low stress.
Excellent temperature resistance performance Application of low compression force in can achieve automated operations.
Typical Applications
network communication equipment: wireless modules, routers, and u VOIP phones
IT–Laptops, storage modules, hard drives, scanners, printers
Consumer electronics–gaming systems, LCD PDP televisions and monitors
Industry-LED, Power Supply, Power Converter, Scanner, Industrial Control Equipment, Automotive Electronic Components
Procurement Information
packing specifications ：
30 single tube, 330ml per tube, 1kg canister packaging
35 KG in barrel packaging. Other colors or packaging require customization.
quality guarantee period
After opening, the shelf life of this product is 12 months.
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