Thermal Conductive Polyurethane Potting Compound (1.3W)

Thermal Conductive Polyurethane Potting Compound

Product features and uses

JOMP 2651A/B is a two-component solvent-free room temperature or heat-curable resin elastomer compound for dual-component sealing and potting applications. This environmentally friendly material, free from heavy metals, offers versatile processability with superior physical properties and excellent substrate adhesion. Capable of curing at both room temperature and under heat, it achieves deep penetration and solidification. The mixture demonstrates exceptional flow characteristics during mixing, while cured specimens exhibit remarkable flexibility and high thermal conductivity. It is widely used in potting and encapsulation processes for communication equipment, transformers, control power supplies, ignition controllers, and electronic sensors.

Suitable for potting of various components

TWO COMPONENT, Low VISCOSITY

Low viscosity, operable

Excellent low temperature characteristics, excellent weather resistance

High thermal conductivity index up to 1.3W/m.K

Excellent electrical insulation and stability

Good adhesion to most metals and plastics

Conventional performance

Order packing

JOMP 2651 A/B polyurethane potting compound,

Part A, packaged  32 kg/barrel,

Part B, package 3.2kg / pot

Storage temperature:

10-30℃, the storage period

of material A is 12 months; the storage period

of material B is 6 months.