Thermal Conductive Silicone Gel Compound

A thermal conductive silicone gel compound is a soft, conformable material that fills the microscopic air gaps between a heat source and a heat sink. Because it stays gel-like after curing, it wets rough surfaces at low pressure while protecting the electronics underneath from moisture, dust and vibration.

These gels come as one-part or two-part systems. One-part grades cure with ambient moisture and suit thin, open assemblies; two-part grades cure through the section and are chosen where a deeper fill or a faster line takt is needed. The filler loading sets how much heat the gel can move, while the base polymer sets the softness, the dielectric behaviour and the temperature range.

Applications and selection points

Typical uses are battery modules, power converters, LED modules, BMS boards, charging piles and telecom hardware, where a gap-filling gel is preferred over a hard potting resin. Selection turns on the required thermal path, the dispense equipment available, the cure schedule and how much stress the components can take. JOME supplies a 2-part thermal conductive potting silicone gel (2.0W/mK), a two-component paste-shaped thermal conductive silicone gel (8.0 W/mK) and a single-component silicon-based thermal conductive gel (14 W/m-K).

As an exporter of Thermal Conductive Silicone Gel Compound from China, JOME prepares the compliance and shipping documents audits require.