UV-curable epoxy-based adhesive

JM 2081 UV-curable epoxy-based adhesive ,This product is a single-component, UV-curable epoxy adhesive that exhibits high bonding strength and excellent toughness on various materials including metals, glass, and ceramics. It demonstrates low curing shrinkage, outstanding resistance to extreme temperatures, moderate viscosity, and thixotropic properties.

product details

JM 2081 UV-curable epoxy-based adhesive

Performance Features

This product is a single-component, UV-curable epoxy adhesive that exhibits high bonding strength and excellent toughness on various materials including metals, glass, and ceramics. It demonstrates low curing shrinkage, outstanding resistance to extreme temperatures, moderate viscosity, and thixotropic properties.

Use and Administration

Designed for structural bonding and sealing applications, specifically developed for securing electronic component harnesses.

performance index

Appearance: Colorless, semi-transparent, viscous liquid

Type:                                                             Modified epoxy

Solvent content:                                                No solvent

Density (g/mL):                                                        1.12

Viscosity (cps):                                                       2200

Brookfield DV-Ⅱ viscometer, 25°C, SC4-15/5 rpm

Thixotropy index:                                                     2.6

 Brookfield DV-Ⅱ viscometer, operating at 25°C, model SC4-15

Storage period:                                                       6 months

(room temperature, protected from light, stored in a dry environment).

Curing Conditions

Irradiated with a 365 nm LED light            2000–3000 mJ/cm²

Performance after curing

Color and appearance:                Colorless, semi-transparent

Hardness (Shao D):                                                 72D

GB/T 531.1-2008 Hardening Test

Shear strength (PC/PC), MPa:                              10

GB 7124-2008

Tensile strength (MPa):                                           35

GB/T 528-1998 Hardening Test

Solidification shrinkage rate,%                            1.2

densimetry

Fracture elongation,%                                              1.5

Water absorption rate,%                                          1.3

Boil in boiling water for 2 hours.

Glass transition temperature Tg:  °C                    105

Electrical Properties

Dielectric constant at 1 MHz:                                 3.8

Dielectric loss at 1 MHz:                                        0.04

Dielectric strength (kV/mm):                                 11

Surface resistivity Ω:                                           6.5×10¹⁵

Surface resistivity: Ω·cm:                                    5.8×10¹⁴

The above data is for reference only. Please refer to actual measurement results when using this information.

matters need attention

1.This product contains epoxy monomers, which may cause mild irritation to the skin and eyes. In case of accidental eye contact, immediately rinse with ample water; if discomfort persists, seek medical examination. For skin contact, promptly wash with soap and plenty of water.

2.Store and transport in a place protected from light.

pack

30cc, 50cc syringes

300 ml plastic container

Packaging can be provided based on user requirements

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