Engineering Formula Summary: Accurate industrial adhesive and potting compound consumption depends on net cavity volume (Vnet = L × W × H × (1 − fcomp)), cured specific gravity (ρ, ranging from 1.02 g/cm³ for clear optical silicones to 2.65 g/cm³ for 8.0 W/m·K thermal gels), gravimetric A:B mix ratio (1:1, 2:1, 4:1, or 10:1), and static-mixer purge waste (3–10%). Use the interactive calculator below to compute exact Part A / Part B resin weights, FIPG/CIPG sealant bead yield per cartridge, and thermal interface temperature drop (ΔT = (Q × BLT) / (k × A)) for verified JOME grades.
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Reference Density, Mix Ratio & Process Consumption Benchmark Table
Notice that higher thermal conductivity potting compounds contain higher loadings of spherical alumina, aluminum nitride, or boron nitride ceramic fillers, which increases specific gravity (ρ) from 1.05 g/cm³ up to 2.65 g/cm³. Always calculate procurement weight in kilograms using the cured specific gravity of the specific thermal grade rather than unfilled resin density.
| JOME Grade | Polymer Chemistry | Thermal Conductivity | Typical Specific Gravity (g/cm³) | Standard Mix Ratio (Weight) | Mass per 100 mL Net Cavity | Category Hub |
|---|---|---|---|---|---|---|
| JOMS 5715A/B | 2K Self-Healing Optical Silicone Gel | 0.18 W/(m·K) | 0.98 g/cm³ | 1 : 1 | 98 g | Silicone Potting |
| JOME 3108A/B | 2K Clear Low-Viscosity Epoxy Potting | 0.25 W/(m·K) | 1.12 g/cm³ | 3 : 1 | 112 g | Epoxy Potting |
| JOMP 2606 | 2K Flame-Retardant PU Potting | 0.75 W/(m·K) | 1.55 g/cm³ | 5 : 1 | 155 g | PU Potting |
| JOME 3113A/B | 2K Thermal Epoxy Potting | 1.2 W/(m·K) | 1.82 g/cm³ | 4 : 1 | 182 g | Thermal Potting |
| JOMS 5230-15 | 2K Addition-Cure Silicone Potting | 1.5 W/(m·K) | 2.05 g/cm³ | 1 : 1 | 205 g | Thermal Potting |
| JOMS 1850-20A/B | 2K High-Conductivity Silicone Potting | 2.0 W/(m·K) | 2.28 g/cm³ | 1 : 1 | 228 g | Thermal Potting |
| JOMG 1980 | 2K Dispense-in-Place Thermal Gel | 8.0 W/(m·K) | 2.65 g/cm³ | 1 : 1 | 265 g | Thermal Silicone Gel |
Frequently Asked Questions on Potting Volume & Mixing Calculations
How do I convert potting mix ratios from weight ratio to volume ratio for dual-cartridge dispensing?
Divide each component’s weight share by its individual unmixed specific gravity (VA / VB = (WA / ρA) / (WB / ρB)). While 1:1 addition-cure silicones like JOMS 5230-15 and JOMS 1850-20A/B have matched Part A and Part B densities (allowing both 1:1 weight and 1:1 volume static mixing), filled epoxy and polyurethane systems often have higher filler loading in Part A than Part B—always verify whether your meter-mix pump uses gear/piston volumetric dosing or gravimetric mass flow control.
Why does reducing bondline thickness (BLT) lower ΔT more effectively than switching to a higher W/(m·K) grade alone?
Because conductive thermal resistance (Rθ = BLT / (k × A)) scales linearly with bondline thickness. Halving the compressed gap from 1.0 mm to 0.5 mm cuts bulk thermal resistance by 50%, which is why low-viscosity structural thermal adhesives (JOMG 2340, 3.6 W/m·K) pressed to a 0.15 mm bondline can achieve lower total thermal resistance than a 2.0 mm thick pad.
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Matched JOME Industrial Formulations: For production bonding, potting, and sealing qualification in this application, evaluate Thermal conductive single-component RTV silicone adhesive（0.82W and 1.5W）, thermal conductive silicone grease（0.5-10 W/m.K ）, Customized Thermal Conductive Pads with Various Thermal Conductivity Values(1.0-25.0 W/m·K), and Single-component silicon-based thermal conductive gel (14 W/m-K) (ISO 9001:2015 and CTI RoHS 2.0 verified; free engineering samples shipped via UPS freight collect).
Frequently Asked Engineering Questions
Q: How do I convert potting mix ratios from weight ratio to volume ratio for dual-cartridge dispensing?
Divide each component's weight share by its individual unmixed specific gravity: VA / VB = (WA / rhoA) / (WB / rhoB). While 1:1 addition-cure silicones like JOMS 5230-15 and JOMS 1850-20A/B have matched Part A and Part B densities, filled epoxy and polyurethane systems often have higher filler loading in Part A than Part B.
Q: Why does reducing bondline thickness (BLT) lower ΔT more effectively than switching to a higher W/(m·K) grade alone?
Because conductive thermal resistance (R_theta = BLT / (k * A)) scales linearly with bondline thickness. Halving the compressed gap from 1.0 mm to 0.5 mm cuts bulk thermal resistance by 50%, which is why low-viscosity thermal adhesives pressed to a thin bondline achieve very low thermal impedance.
Industrial Adhesive Categories, Matched Grades and Engineering Guides
Product and Application Categories: Thermally conductive adhesive · Thermal Conductive Sealant · Thermal Conductive Pad · Silicone Potting Compound · Structural Adhesive · Silicone Structural Adhesive · Anaerobic Structural Adhesive · Silicone Sealants · Epoxy Sealants · UV Curing Adhesives · UV Silicone Sealant · Anaerobic Adhesive · Anaerobic threadlocker adhesive · Thread sealant · UV Curable Acrylic · Lubricating grease · Medical Grade Silicone gel · Company News Guides · Applications Guides · Electrical Appliances / Household Appliances / Consumer Electronics Guides · Wind power Guides · Medical Devices Guides
Matched Industrial Adhesives: Thermal Conductive Polyurethane Potting Compound（0.82W） · Medical-grade 2-Part Silicone Gel Scar Repair · Pre-coated thread sealant Water-based environmentally friendly（White, Red, Blue） · 2K Thermal Conductive Polyurethane Structural Adhesive（1.3W） · UV light rapidly cures thin-layer Potting Compound · Thermal conductive single-component RTV silicone adhesive（0.82W and 1.5W） · Single-component silicon-based thermal conductive gel (14 W/m-K) · 2-part silicone bonding adhesive high elasticity · UV silicone dual-curing high elasticity sealant can replace rubber sealing rings · Single-component RTV fluorosilicone sealant · Single-component heat-curing epoxy structural adhesive · 204 Microcapsule pre-coated threaded locking adhesive · 567 Anaerobic metal pipe thread sealant · Thermal conductive single-component RTV silicone adhesive（0.82W and 1.5W） · Micro Capsule Epoxy Thread Locking Agent · Thermal Conductive potting Silicone Compound(1.5W) · General-purpose epoxy potting compound (black, white, red, clear) · SMT epoxy base surface mount red adhesive · 10:1 Condensation type high bonding strength silicone potting compound
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