Adhesive solutions for LED assemblies: JOME product characteristics:
● Excellent thermal stability
● Extremely low moisture absorption
● Adjustable modulus
● Low ion content
● Excellent optical performance
● Adhesion to most materials
● No by-products● Extremely low shrinkage
LED packaging materials
| product classification | gel | elastic body | |||||
| product model | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 |
| refractive index | 1.41 | 1.52 | 1.41 | 1.41 | 1.52 | 1.52 | 1.52 |
| distinguish | Upon curing, it forms a very soft material. | Upon curing, it forms a strong and elastic material. | Upon curing, it forms a hard and durable material. | ||||
| Adhesion | good | good | fine | fine | fine | good | good |
| apply | Fluorescent powder mixture, lens filling | Lens filling, COB integration | Lens Mold Resin | ||||
Bulb Light
| Application Point | Adhesive seed | model | characteristic |
| Light bulb cover bonding and fixation | silica gel | JOMS5336T | Transparent, yellowing-resistant |
| Epoxy structural adhesive | JOME3117 | Quick-drying with strong adhesion | |
| Aluminum substrate thermal conductivity | Thermal grease | JOMSG2101、2125 | Thermal conductivity: 1.2 and 2.5 W/(K·T) |
| Thermal silicone gel | JOMS5316 | Adhesive strength; thermal conductivity values: 0.8 and 1.5 | |
| Circuit section thermal sealing | Thermal silicone gel | JOMS5230 | 1:1 ratio; excellent fluidity; thermal conductivity: 0.8 |
| Thermal silicone gel | JOMS5300 | 10:1 – Excellent adhesion; thermal conductivity: 0.8 | |
| polyurethane | JOMP2605 | 5:1; flame retardant; thermal conductivity: 0.6 |
Starlight Lamp
| Application Point | Adhesive seed | model | characteristic |
| Light bulb cover bonding and fixation | silica gel | JOMS5336T | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| Aluminum substrate thermal conductivity | Thermal grease | JOMSG2101、2125 | Thermal conductivity: 1.2 and 2.5 W/(K·T) |
| Thermal silicone gel | JOMS5316 | Adhesive strength; thermal conductivity values: 0.8 and 1.5 | |
| PCB board encapsulation | Silicone encapsulant | JOMS5115Y | 100:10:1 – Matte black – High toughness |
| Silicone encapsulant | JOMS5125T | 10:1 – High light transmittance | |
| Circuit section thermal sealing | polyurethane | JOMP2605 | 10:1 – Excellent adhesion; Thermal conductivity: 0.8 |
projector
| Application Point | Adhesive seed | model | characteristic |
| Light bulb cover bonding and fixation | silica gel | JOMS5336T | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| Lens bonding and fixation | silica gel | JOMS5338H | Transparent, resistant to yellowing, excellent adhesion, and does not turn white. |
| Terminal lead bonding and fixation | silica gel | JOMS5321 | Single-component formula – quick drying, excellent toughness |
| Circuit section thermal sealing | silica gel | JOMS5300 | 1:1 ratio; excellent fluidity; thermal conductivity: 0.8 |
Lightweight bricks
| Application Point | Adhesive seed | model | characteristic |
| PCB and optical brick bonding and fixation | silica gel | JOMS5336T | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| PCB backside fill buffer layer | polyurethane | JOMP2010 | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| Terminal lead bonding and fixation | silica gel | JOMS5321 | Single-component formula – quick drying, excellent toughness |
Line Light
| Application Point | Adhesive seed | model | characteristic |
| Light source and PCB encapsulation | silica gel | JOMS5125T | 10:1 – High light transmittance, excellent toughness, and strong adhesion to aluminum frames |
| End cap and lens bonding and fixation | silica gel | JOMS5338H | Single-component, transparent; resistant to yellowing; excellent adhesion; does not turn white. |
| Glass top cover bonding | silica gel | JOMS5336T | Single-component, transparent, yellowing-resistant, and high adhesion performance |
| PCB thermal encapsulation | silica gel | JOMS5125W/B | 10:1 – Black, White – High toughness |
| silica gel | JOMS5300W | 10:1, White, Thermal Conductivity: 0.8 | |
| Terminal lead bonding and fixation | silica gel | JOMS5321 | Single-component formula – quick drying, excellent toughness |
| Circuit section thermal sealing | silica gel | JOMS5230 | 1:1 ratio; excellent fluidity; thermal conductivity: 0.8 |
Underwater lights, buried lights
| Application Point | Adhesive seed | model | characteristic |
| Guardrail Pipe Sealing End Cap | silica gel | JOMS5311T | Single-component, transparent; fast surface drying time; excellent toughness. |
| Guardrail pipe – PCB thermal conductivity | Thermal insulation gasket | JOMG-340 | Thermal conductivity: 1.0; suitable for single-or double-sided adhesive application. |
| Soft light strip – epoxy resin | epoxide-resin glue | JOME1500 | 2:1 ratio; transparent; resistant to yellowing; excellent adhesion; high toughness |
| Application Point | Adhesive seed | model | characteristic |
| Sealing adhesive bonding for the frame and lead wires | silica gel | JOMS5311T | Single-component, transparent; fast surface drying time; excellent toughness. |
| Underground light strip encapsulation | epoxide-resin glue | JOME5108-3 | 2:1 ratio; matte white; high hardness |
Adhesive solutions for LED assemblies: separate the optical path from the heat path
When specifying adhesive solutions for LED assemblies, map the optical and thermal paths separately. Material around a lens must preserve the intended light distribution, while material beneath a board or package must support heat transfer to the next surface. A clear appearance does not establish useful thermal contact, and a thermally filled compound should not be assumed suitable for the viewing area. Identify every region where adhesive can flow before curing, including gaps that lead toward the lens or reflector. A small change in placement may affect the optical function without causing visible bond failure. Review the complete stack: the light source, its mounting surface, the heat spreader and the enclosure each contribute to the result. For an interface under the board, surface conformity and bond-line control matter alongside the material’s thermal properties. Voids and uneven contact can interrupt the heat path. Adding more compound is not a universal fix because the layer must still suit the designed gap. The thermally conductive adhesive range is relevant when that interface also needs a bonding function. Determine how the parts are retained and whether the material is expected to carry mechanical load. Optical encapsulation needs its own compatibility review with lenses, coatings and surrounding plastics. Changes in clarity or deposits on an optical surface may be functionally important even when adhesion remains acceptable. Why accept a secure lens if the adhesive process changes the light leaving it? It’s better to define optical appearance and output checks before the assembly is enclosed. Differential movement also deserves attention where glass, metal and plastic meet. A rigidly held lens and a moving enclosure can load a narrow bond differently from a broad board interface. Review curing shrinkage, handling fixtures and the allowed movement at each location. The resulting selection should identify which material joins the lens, which transfers heat and which protects the electronics, instead of expecting an unspecified adhesive to satisfy every duty.
Trace moisture routes and verify the luminaire after assembly
For outdoor installations, adhesive solutions for LED products should be evaluated against the actual enclosure and cable geometry. Rain or cleaning water can reach a housing seam, an end cap or a wire entry through different routes. A continuous outer bead is useful only if adjacent transitions do not provide another path. At a cable entry, inspect the jacket interface and the construction of the cable; an external seal does not necessarily stop moisture traveling within it. Potting a board introduces another protective layer, but it does not automatically establish that the complete housing excludes water. The potting compounds for electronic assemblies can support material discussions for that task, with the desired fill region and repair access identified. Review whether the fill reaches the critical surfaces without covering connectors or other functional features. Check curing against the actual materials in contact with the compound, since residues or neighboring sealants can affect some curing systems. Observe representative specimens for incomplete cure, trapped air and separation from the enclosure. Then evaluate the finished light under consistent electrical loading and cooling conditions. Compare the heat path, optical appearance and electrical behavior before and after the relevant exposure. A cooler outer casing alone does not prove that the light source runs cooler, so choose measurement locations that address the design question. When investigating a failure, distinguish water tracking along an interface from cracking inside the cured compound. Also distinguish loss of transparency from misalignment of the lens or reflector. Those observations point toward different changes in material, placement or joint geometry. Repeated temperature changes can reveal movement that was absent during initial assembly; cleaning exposure can reveal an incompatible surface treatment. Include such conditions when they match the intended use, rather than applying unrelated tests to every light. Keep the dispensing pattern, surface preparation, cure route and assembly sequence in the evaluation record. This gives the engineer a basis for checking production changes without making unsupported claims about the performance of every adhesive in the lighting system.
The full JOME product catalogue named above is one part of the JOME production line. For the earlier discussion of New Energy Drive Motor Stator Winding Encapsulation, follow the link, or browse the the JOME industrial adhesive range; specifications and samples go through the talk to the JOME application engineers.