Single-component low-temperature heat-curing epoxy structural adhesive

JOME 3665 is a low temperature curing one-component epoxy adhesive with high adhesion, low water absorption, suitable for bonding a variety of materials, and good storage stability.It is designed by recombine and optimize of two-component high toughness and flame-retardant epoxy adhesive.

Application

It is mainly used for lens bonding of LED backlight module and bonding of CCD/CMOS frame of camera module, which is suitable for bonding temperature sensitive components.

product details

Product description

Application

It is mainly used for lens bonding of LED backlight module and bonding of CCD/CMOS frame of camera module, which is suitable for bonding temperature sensitive components.

Technical parameters before and after curing

ITEM	Test method or condition	Unit		Test results
				JOME 3665
Appearance	Visual	–		White
Viscosity	GB/T 2794- 1995 Brookfield LV 95#	mPa·s, 25℃		45,000
Density	GB/T 13354- 1992	g/cm3, 25℃		1.45
Thixotropic index	–	–		3.5
Hardness	GB/T 2411- 1980	Shore-D, 25℃		68
shear strength	GB/T 7124- 1986	Mpa	TSS-Fe	15
			TSS-Al	10
elongation at break	GB 1040- 1992	%		10
Glass transition temperature	ASTM E1545	τ (TMA)		45
Coefficient of thermal expansion	GB/T 1036- 1989	α1 (PPM/)		45
		α2 (PPM/)		130
Water absorption rate	GB/T 1034- 1998	%(24h@25℃)		0.15
Dielectric strength	GB 1408.1- 1999	KV/mm		≥ 20
Volume resistivity	GB/T 1410-2006	Ω		1×1015

(The sample is cured at 80℃for 30 minutes)

Recommended curing conditions:

At 100℃ , it takes 4 minutes to cure.

At 80℃ , it takes 5 minutes to cure.

At 75℃, it takes 10 minutes to cure.

The curing speed depends on the size of the heating device and the object to be bonded. The curing time should be adjusted appropriately according to the heating device and the object to be bonded.

Packing:

JOME 3665,

Packing：30ml/PCS 、1kg/Barrel.

Storage conditions

Store in a clean, dry place at -20℃ .

Storage period: six months.