In mixed-technology and double-sided printed circuit board (PCB) manufacturing—such as automotive body control modules, home appliance power boards, industrial inverter drivers, and LED power supplies—surface mount devices (SMDs) mounted on the bottom side of the PCB must pass directly through a molten solder wave at 260°C or endure secondary reflow without shifting or tombstoning.
SMT Red Glue (single-component latent heat-curing surface mount epoxy adhesive) is dispensed or stencil-printed between solder pads prior to component placement. Once cured in a short convection oven zone, it anchors passive chips (0402, 0603, 0805, 1206), SOT/SOP transistors, and heavy MELF diodes firmly to the FR-4 solder mask throughout fluxing, preheating, and wave soldering.
Engineering Category & Product Reference: View our dedicated SMT Epoxy Base Surface Mount Red Adhesive as well as our broader Epoxy Structural Adhesive and PCB Board Glue Solutions.
1. Why Rheology & Thixotropic Index Dictate SMT Line Yield
Modern high-speed jet dispensers and pneumatic needle dispensers operate at 30,000 to 50,000 dots per hour. If an SMT adhesive lacks sufficient shear-thinning behavior (thixotropic index TI = Viscosity at 1 rpm / Viscosity at 10 rpm), two fatal defects occur:
- Tail Stringing (Cobwebbing): As the dispensing nozzle retracts at high speed, a string of epoxy drags across adjacent copper solder pads, causing open solder joints or cold joints after wave soldering.
- Dot Slump During Preheat: If the yield stress drops when the PCB enters the curing oven, a tall conical adhesive dot collapses laterally onto the solder pads before gelling, failing to contact the underside of higher-standoff SOIC or SOT-23 packages.
JOME SMT Epoxy Base Surface Mount Red Adhesive is engineered with a thixotropic index of 5.5 to 7.0: viscosity drops sharply under high shear inside the dispensing needle or stencil squeegee aperture, then recovers instantaneously upon deposition to hold a high aspect-ratio dot profile.
2. Technical Specifications of JOME SMT Surface Mount Red Adhesive
| Parameter | Test Method / Condition | Typical Value (JOME SMT Red Glue) | Engineering Significance |
|---|---|---|---|
| Base Chemistry | Latent 1K Heat-Curing Epoxy | Modified Bisphenol-A Epoxy + Latent Curing Agent | Single-component, no mixing required, long stencil life |
| Appearance | Visual | High-Contrast Red Paste | Easy AOI (Automated Optical Inspection) contrast against green/black solder mask |
| Viscosity (25°C) | Brookfield HBT, Spindle #14 | 35,000 – 65,000 mPa·s (Custom dispensing & printing grades) | Supports both high-speed dot dispensing and stencil printing |
| Thixotropic Index (TI) | 1 rpm / 10 rpm ratio | 5.5 – 6.8 | High dot height retention without pad contamination |
| Cure Schedule | Convection / IR Reflow Oven | 150°C for 60–90 sec (or 120°C for 150 sec) | Rapid inline curing compatible with standard SMT reflow profiles |
| Push-Off Strength (0805 Cap) | 25°C / After 260°C Wave Solder | ≥ 35 N at 25°C; retains high hot-strength at 260°C | Zero component drop-off in lead-free SAC305 wave soldering |
| Storage & Syringe Life | 2–8°C Refrigerated / 25°C Line | 6 months at 2–8°C; ≥ 7 days open life at 25°C | Minimizes syringe waste during multi-shift production |
3. Related 1K Latent Heat-Curing Epoxy Solutions
Beyond PCB surface mount bonding, JOME manufactures specialized latent single-component epoxies for structural and electronic assembly, including Single-Component Low-Temperature Heat-Curing Epoxy Structural Adhesive (curing at 80–100°C for temperature-sensitive camera and sensor modules) and Single-Component Heat-Curing Epoxy Structural Adhesive. Read our One-Component Epoxy Selection Guide for full curing kinetics.
Quality Management, RoHS 2.0 Verification & OEM Sample Protocol
For international OEM and Tier-1 electronics, automotive, and industrial assembly buyers, material traceability and environmental compliance are mandatory qualification gates. Shanghai Jumi Industrial Co., Ltd. (JOME) operates under certified quality and environmental management systems and maintains third-party CTI laboratory test verification across core adhesive chemistries:
- ISO 9001:2015 Quality Management System: Certified under Certificate No.
86724Q10331R0S(IAF / CNAS accredited) covering industrial adhesive sales and technical quality assurance processes. - ISO 14001:2015 Environmental Management System: Certified under Certificate No.
86724E10332R0S(GB/T24001-2016 / ISO14001:2015). - EU RoHS 2.0 Directive (EU) 2015/863 & 2011/65/EU Compliance: Independent CTI test reports (including Reference
A2260902964104001 / A2260902964105001 (Epoxy Series)for SMT Surface Mount Epoxy Adhesive) verify non-detection (ND) across all 10 restricted substances: Lead (Pb), Cadmium (Cd), Mercury (Hg), Hexavalent Chromium (Cr VI), PBBs, PBDEs, and the four phthalates (DEHP, BBP, DBP, DIBP). Note: JOME provides full CTI RoHS 2.0 reports and MSDS/TDS documentation; EU 2015/863 chemical compliance documentation is provided. - OEM Sample & International Shipping Policy: Small-quantity engineering evaluation samples are provided free of charge to qualified B2B manufacturers. International sample shipments are dispatched primarily via UPS (shipping cost varies by destination country and is paid by the customer via UPS account / freight collect).
Need custom viscosity adjustment, cure profile tuning, or an engineering sample kit for your production line? Contact JOME Application Engineering with your substrate pair, operating temperature range, and target cycle time to receive a matched TDS package and UPS sample dispatch.
Matched JOME Industrial Formulations: For production bonding, potting, and sealing qualification in this application, evaluate UV light-curing rapid fixation structural adhesive, UV-curable epoxy-based adhesive, High resilience UV glue replaces silicone rubber sealing ring, and SMT epoxy base surface mount red adhesive (ISO 9001:2015 and CTI RoHS 2.0 verified; free engineering samples shipped via UPS freight collect).
Frequently Asked Engineering Questions
Q: What industrial adhesive chemistries does JOME recommend for SMT Red Glue and Surface Mount Epoxy Adhesive: Dot Profile, Slump Resistance and Wave Soldering Reliability?
JOME engineers matched epoxy, silicone, polyurethane, UV-curable, MMA acrylic, and anaerobic formulations tested under ISO 9001:2015 (86724Q10331R0S) and CTI RoHS 2.0 (EU 2015/863).
Q: Are CTI RoHS 2.0 test reports and free engineering samples available?
Yes. All JOME core adhesive lines carry verifiable CTI RoHS 2.0 reports (A2260902964101001–A2260902964112001). Small-quantity test samples are provided free of charge via UPS (freight collect).
Q: How fast can JOME provide a cross-reference or custom formulation quote?
Share your substrate pair, operating temperature, cure window, or target part number via sales@jomebond.com to receive a matched TDS and engineering quote within one business day.
Industrial Adhesive Categories, Matched Grades and Engineering Guides
Product and Application Categories: Thermal Conductive Bonding Adhesive · Thermal Conductive Grease · Epoxy Potting Compound · UV Potting Compound · Polyurethane (PU) Structural Adhesive · SMP Hybrid Structural Adhesive (MS Adhesive) · Sealant · SMP Hybrid Sealants (Silane Modified Polyether) · UV Curing Sealant · UV Cationic Epoxy Adhesive · Optical Clear UV Adhesive · Pre-coated threadlocker adhesive · Cylindrical retaining adhesive · Silicone · Polyurethane (PU) · Special · Fluorosilicone Sealant · Industry News Guides · Photovoltaic + Energy Storage Integration Guides · Hardware Accessories, Tools, Fasteners Guides · Semiconductor precision packaging Guides
Matched Industrial Adhesives: Silicone surface treatment agent primer coating agent · Single-component solvent-free elastic silicone rubber conformal coating · Thermally Conductive Epoxy Potting Compound（1.2W） · Single-component RTV silicone sealant (black, white, gray, red)-OEM · Clear long-term yellowing-resistant polyurethane encapsulation coating compound · Customized Thermal Conductive Pads with Various Thermal Conductivity Values(1.0-25.0 W/m·K) · High-strength 2-part epoxy structural adhesive · One-part highly elastic SMP Hybrid Structural Adhesive (MS Adhesive) · UV light-curing rapid fixation structural adhesive · 2K polyurethane structural adhesive · 2 – Part fluorosilicone sealant can effectively resist solvents, lubricants and gasoline · 638 Cylindrical metal bearing adhesive for fixation · Thermal insulation polyurethane structural bonding adhesive（2.0W） · Two-component high thermal conductivity filling sealant (8.0 W/mK) · Epoxy group microcapsule pre-coated threaded locking agent meets automotive industry standards. · Vehicle-grade transparent self-healing encapsulated silicone gel · 2K High-Temperature Resistant Epoxy Structural Adhesive · Clear shadowless UV glue is used for bonding glass and accessories · 2-Part Thermal Conductive potting Silicone Gel （2.0W/mK）
Technical Application Guides: Comparison Table of Core Characteristics of Three Types of Sealing Gels: Epoxy Gels, Silicone Gels, and Polyurethane Gels · Top Industrial Adhesive, Potting Compound & Thermal Interface Material Manufacturers: Engineering Comparison & OEM Sourcing Guide · Common issues with automotive power supply potting compounds: high viscosity, reduced strength, and poor heat dissipation · The Importance of Potting Compound in SST Solid-State Transformers · Requirements and Applications of Medical-Grade Adhesives (Endoscopic Capsules) · The gap between the copper tubing and the aluminum plate determines the upper limit of heat dissipation for the liquid-cooled plate · Adhesive Manufacturer & Supplier for Construction & Building · MS Polymer Adhesive and Sealant: Silane-Modified Hybrid Selection Guide · Silicone Potting Glue: Selection and Application Guide · Anaerobic Adhesive, Thread Adhesive Selection Guide: Instant Adhesive for Assembly and Maintenance · Advanced Adhesive Solutions for Smart Utility Meters (Electricity, Gas, & Water) · Advanced Thermal Interface Materials (TIM) Application Solutions: Telecom, Home Appliances, Automotive, and Mobile Devices · Introduction to Adhesives: Do You Really Understand Them All? — Adhesives Knowledge (Part 2) · A Comprehensive Guide to Structural Adhesives · Do you truly understand adhesives? An In-depth Guide to Adhesives Knowledge · What adhesive should be used for PE coating? · What adhesive should be used for PI-coated copper foil? · Which adhesive should be used to bond metal film materials? · Which adhesives are suitable for forming a film? · Adhesive for optical communications: specialty resin · Technical Analysis: Synthesis Principles and Key Applications of UV-High-Refractive-Index Resin and Monomers · A Brief Analysis of Dual-Curing UV Resins: Types and Applications · Adhesive Solutions for Public Transportation · Introduction to Adhesive Solutions for the Aerospace Industry · Introduction to adhesive and lubricant solutions for bearings and gears · The adhesive solution used in the bonding process (Die Attach adhesive) · Adhesive solution for electronic equipment control systems of new energy vehicles · Introduction to the Glue Solution for PCB Boards · New Energy Drive Motor Stator Winding Encapsulation Process · Five key applications of adhesives in the photovoltaic industry · Application solutions for adhesives used in aviation and ships · Adhesive Application Solution for Solar PV & Energy Storage System · Semiconductor packaging adhesive solution