Controller box:
• Power controller casing sealing scheme
• Salt spray cycle 480h test is required
• Splash oil test
• Permanent compression deformation is small.
• It can be returned and dismantled.
| Rx | JOMS 1820 | JOMS 1830（ H50） |
| type | Single component molding silicone | Two-component molding silicone |
| characteristic | • Single-component ointment• The color istransparent/white/grey/black• Hardness A38• Low compression permanent deformation• Rapid curing 150 degrees 25min | • Two-component addition molding• 1:1 mixing mass ratio• Hardness A50,• Solidify at 80 degrees for 2 hours• Most materials have adhesion to no primer• The elastomer properties are maintained at-54℃ |
Controller box:
• Power controller casing sealing scheme
• Salt spray cycle 480h test is required
• Splash oil test
• Permanent compression deformation is small.
• It can be returned and dismantled.
| Sealing method | Early investment | cost of material | Late fees | composite cost |
| packing washer | cost of mould | 2 yuan per piece | Manual installation | Low efficiency and high cost |
| Screw injection process | Syringe equipment | 1 yuan per piece | Oven/electricity | High efficiency cost reduction |
CI PG technology
| WK988 | JOMS 1820 | |
| component | 1k | 1k |
| dynamic viscosity | 440000mPas 0.5s | ] pasty propellant rocket engine |
| dynamic viscosity | 34000mPas,25s | ] pasty propellant rocket engine |
| pigment | gray | gray |
| density | 1.1 | 1.06 Low density, weight lo |
| hardness | 35A | 33A |
| tensile strength | 4.5Mpa | 4MPa |
| elongation at break | 350% | 350% |
| tear strength | 24N/mm | 35N High tear strength |
Chip cooling
• Power controller chip heat dissipation solution
• Small batch portability
• long-term storage
• Customized cutting
• Thermal conductivity 3w, thickness 1mm
• Recommended compression of 20-30%
• Customer groups: Lg Innotech, Neusoft, Valeo, Continental, Lear, Jingwei Hengrun
| Rx | JOMG 30 | JOMG 500 |
| type | 1-5W/ mk0.5-3mm thickness | 5-14W/ mk1-8mm thick |
| characteristic | • Thermal conductivity 3W/ mk• PI film composite, soft and compressible• Excellent insulation performance• Working temperature- 40/200 degrees• Customized cutting• Flame retardant V0 | • Thermal conductivity 5W/ mk• Double-sided self-adhesive• high compression ratio• Working temperature-50/200 degrees• Customized cutting• Flame retardant V0 |
The heating element dissipates heat
• Thermal gel for the power controller
• Good wrapping of the opposite sex, higher thermal conductivity
• Mass production is more efficient and the overall cost is reduced
• 2.5w thermal conductivity client base ：
• Asustek/Garuda, Desay SVI, Flextronics, Ambof, Coboda, Jingwei Hengrun
| Rx | JOMS 1925 | JOMS 1960 |
| type | Two-component thermal conductive filler | Two-component thermal conductive filler with a maximum of 8W/ mk |
| characteristic | • Two-component 1:1• blue• Density 2.95• Hardness 00 70• Heat transfer 2.5W/ mk• Flame retardant V0• Temperature resistance-60/200• Curing at room temperature for 5h | • Two-component 1:1• pink• Density 3.9• Hardness 00 8• Heat transfer 6W/mk• Flame retardant V0• Temperature resistance-60/200• Curing at room temperature for 1.5h |
Controller element positioning
Power controller component positioning, quick curing, single component. JOMS1859 competitor: DC 7091
Oil resistant element positioning, long term oil resistant, single component. JOMS 1859
| DC 7091 | JOMS1859 | |
| surface | Non-flowing paste | Pasty |
| pigment | Black, white and gray | White / dark grey / black |
| Drying time | 28 | 15 ± 5 |
| durometer-hardness A | 32 | 40 ± 5 |
| tensile strength | 2.5 | 2.8±0.3 |
| Extensional elongation | 680 | >400 |
| Rx | JOMS 1859 |
| type | Single component silica gel |
| characteristic | • Single component• 15 minutes of surface drying• Hardness A40• quick positioning• Can be used in FIPG process• oil proof• Temperature resistance-60/300 degrees |
The surface of a PCB circuit board is covered with three protective layers
• Power controller PCB: soft three-layer protection, detachable, fast UV curing, this
Light-colored areas can be slowly cured through humidity. Use 9060M
High-strength protective film, heat-resistant, high adhesive strength, wear-resistant and solvent-resistant. Use 5007
| Rx | JM 9060M | JOMS 9007 |
| type | UV/water resistance | Single component silicone resin |
| characteristic | • A pale yellow liquid• Viscosity 200mPas• Solid content> 99%• Working temperature-65/135• Flame retardant V0 | • Single component• transparent• Viscosity 800mPas• Solid content 70%• Surface curing at room temperature for 15min• Hardness A80• Temperature resistance-60/200 degrees |
Cavity potting
• Power controller cavity fill: 0.8W polyurethane potting compound. Costar.
• 1.5W silicone potting compound. Vmax, Huichuan
• 2W silicone potting compound. Huichuan
• 4W silicone potting compound. Tesla
| RxSolution | JOMP 1680 A/B | JOMS 8250 A/B series |
| type /Type | Polyurethane potting compound No return to the original place | Silicone potting compound 1.5-4W/ mk |
| characteristic Features | • 100:16• Hydrostatic viscosity 1400 mPas• Hardness A85• Thermal conductivity 0.8 W/ m.k• Temperature resistance-50/130C• High bonding strength• Flame retardant V0 | • 1:1 molding• Thermal conductivity 1-4 W/ m.k• Temperature resistance-60/200C• Certain bonding strength• Flame retardant V0 |
Mapping the power controller’s thermal and sealing requirements
Inside a power controller, begin material selection with a drawing that connects each heat-generating device to its intended cooling surface. Identify where the thermal interface ends and where the enclosure releases heat. Then mark the housing seal, component attachments, and board protection areas separately. This prevents a cooling material from being assigned an unsupported sealing or fixing duty. The development brief should describe the actual installation, load conditions, and service access, so that each material trial answers a specific question about the controller.
Manage the installed cooling gap
At a power controller cooling interface, the installed gap can vary with component height, mounting position, and housing flatness. A compressible pad and a dispensed filler respond differently to that variation. Evaluate the pressure or displacement transferred into the component as well as the resulting thermal contact. Candidates from the thermally conductive adhesive range should be compared in the intended geometry. Selecting from a bulk conductivity description alone can miss poor contact or a mechanical load that the component should not carry.
For a power controller under electrical load, interface contact is only part of the heat-transfer problem. A well-filled gap cannot compensate for inadequate cooling beyond the receiving surface. Use consistent operating conditions and measurement locations to compare candidate interfaces. Check the device and the nearby cooling structure together, then relate the observations to the heat path. A lower enclosure temperature alone is ambiguous: the enclosure might be rejecting heat more effectively, or less heat might be reaching it from the device.
Keep insulation design separate from thermal contact
Within a power controller, electrical insulation needs to be assessed independently of thermal performance. A material’s bulk insulating behavior does not establish that the assembled spacing, surface path, or interface geometry is suitable. Dispensed material can move during assembly, and a pad can shift or become damaged. Check the intended coverage and the relevant electrical behavior in the assembled unit. Keep creepage and clearance requirements tied to the electrical design instead of treating an insulating thermal material as a substitute for that design.
A serviceable power controller needs a deliberate enclosure seal and a defined opening procedure. Inspect flange distortion, fastener loading, coating condition, and bead continuity. Compression after cure and bonding while uncured create different interfaces, with different rework considerations. The sealant product range provides candidates for the specified approach. Include corners and connector boundaries in the trial because a satisfactory straight section does not reveal every leakage path. Verify the proposed cleaning and reassembly process where repeated access is intended.
Controlling application and checking the finished controller
Component support, board protection, and cure
When fixing a power controller component, consider which direction the attachment must resist and where the load enters the bond. A soft thermal interface may improve contact without providing permanent structural retention. A component-fixing bead may support a projecting part without creating the desired cooling path. Keep those purposes explicit. It’s helpful to inspect the attachment after assembly movement, because a bead can look continuous while contacting only part of the intended surface or applying stress to an unsupported connection.
Before protecting a power controller board, decide which regions need coating or encapsulation and which must remain accessible. Connectors, intended vents, test points, and adjustment features can require masking or a different protection strategy. Examine fill beneath components rather than only the exposed top surface. Potting can also couple parts mechanically and restrict repair access. Verify electrical operation before processing and after cure so that a functional change can be investigated while the assembly and process details are still available.
During a power controller material trial, use the selected formulation’s instructions for cleaning, proportioning, mixing, and cure. A ratio stated by mass is not interchangeable with a ratio stated by volume. Moisture-curing materials need an evaluation of cure access, while mixed systems require evidence of proportioning and mixing quality. Check compatibility with substrates and process residues. Preserve a controlled reference when investigating cure differences; this helps distinguish a local contact problem from a broader material-handling issue.
Link thermal, environmental, and functional checks
What does a clean power controller housing prove if thermal contact is lost after cycling? Use staged checks that establish initial electrical and thermal behavior, repeat the relevant observations after conditioning, and inspect the interfaces for changes. Keep mounting, electrical load, sensor attachment, and measurement locations consistent. Where vibration, fluid exposure, or temperature changes are relevant, include the actual enclosure and connector arrangement. A material specimen provides useful information, but it cannot represent distortion or leakage introduced by the controller assembly.
When a power controller fails a check, inspect the interface before changing the formulation. Local temperature rise calls for a review of contact and downstream cooling. Leakage calls for tracing the complete enclosure boundary. Partial cure calls for a review of material handling, mixing, and contact chemistry. Retain photographs and process records from the opened sample. Reproduce the suspected cause in a controlled trial, then verify the corrective change against the original acceptance question rather than relying on a better-looking bond.
JOME manufactures the full JOME product catalogue in its own factory for customers in more than 30 countries. Readers continuing from Adhesive solutions for LED and LED related will find the Shanghai JOME Industrial adhesive portfolio covers the full portfolio, and project questions go to the contact the JOME technical team.