Thermal conductive single-component RTV silicone adhesive(2.85W )
JOMS 5928 is a hygroscopic, curable, neutral, alcohol-free silicone gel that incorporates special heat-conductive materials. Its thermal conductivity reaches up to 2.85 W/m.K. After curing, it forms a flexible rubber-like substance, fully meeting the requirements of the EU ROHS standard.
It is suitable for sealing LED lights; heat dissipation of automotive electronic components; thermal management and sealing of PCB boards and electronic components.
It is used to fill the gaps between high-power transistors, thyristor components, diodes and substrates (aluminum or copper).
product details
Thermal conductivity RTV JOMS 5928 series bonding and sealing adhesive
Product description
JOMS 5928 is a moisture-absorbing , cureable neutral alcohol-free silicone gel enhanced with specialized thermal conductive materials, which forms a flexible rubber-like substance upon curing and fully complies with EU ROHS requirements . During curing , it releases alcohols that are non-corrosive to polycarbonate (PC) , copper, and most other materials, providing excellent adhesion and sealing performance to ensure stable protection for electronic devices under harsh conditions .
JOMS 5928 silicone adhesive sealant exhibits the following properties as a cured elastomer:
Has a high thermal conductivity
The coating layer is elastic , free from yellowing or oil penetration , and exhibits excellent overall performance .
Resists moisture , contaminants, and other atmospheric components
Reduce mechanical stress and tension caused by mechanical, thermal shock, and vibration .
Exhibits excellent electrical insulation properties and corona resistance .
Stable mechanical and electrical properties between -60 and 200 °C
Exhibits excellent outdoor aging resistance with a service life of up to 20–30 years .Application fields
Sealing of LED lamps; heat dissipation for automotive electronic components; thermal management and sealing for PCB boards and electronic components .
Filling the gap between high-power transistors, thyristor components, diodes , and the substrate (aluminum or copper) .
Technical parameters before and after curing:
| test item | testing standard | unit | JOMS 5928 |
| Pre-curing properties | |||
| pigment | visualization |
— |
white |
| viscosity | GB/T 2794-2013 | 25℃ , mPa ·s | The paste is nearly collapsed. |
| density | GB/T 15223- 1994 | 25℃ , g/cm3 | 3. 1 |
| Surface drying time | GB/T13477 .5-2002 | 25℃ , 55%RH,min | 5- 10 |
| Properties after curing | |||
| hardness | GB/T 531-2008 | Shore A | 70 ± 5 |
| thermal
conductivity |
GB/T 10297- 1998 | W/m .K | 2.85 |
| Tensile elongation at break | GB/T 528- 1998 | % | > 15 |
| tensile strength | GB/T 528-2009 | MPa | ≥1.0 |
| shear strength | GB/T 7124-2008 | MPa, iron/iron | ≥1.2 |
| dielectric strength | GB/T 1695-2005 | kV/mm(25℃) | > 10 |
| Loss Factor | GB/T 1693-2007 | (1MHz) (25℃) | 0.09 |
| dielectric constant | GB/T 1693-2007 | (0.5 MHz) (25℃) | 5.7 |
| volume resistivity | GB/T 1692-92 | (DC500V) Ω · cm | 1.00E +11 |
packing specifications:
JOMS5928, 300 ml per vial; 25 vials per box.
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