2-Part Thermal Conductive potting Silicone Gel (2.0W/mK)

JOMS1850-20A/B is a two-component silicone thermal conductive encapsulant that exhibits excellent fluidity after mixing; its application time can be adjusted according to temperature, and it cures deeply at room temperature. Its key characteristics include:
Dual-component addition-curing silicone rubber
1:1 Mixing Ratio
Low hardening shrinkage rate
Excellent high-temperature electrical insulation properties and stability
application area :
Automotive electronics & modules
LED Power Supply Drive Module
Solar module junction box
Electric Vehicle Charging Pole Module
Lithium-ion battery pack, Capacitor pack
Magnetic sensing coil inverter

product details

JOMS1850-20 Thermal Insulating Potting Silicone Gel Compound

Product Features and Application

 JOMS1850-20A/B is a two-component silicone thermal conductive encapsulant that exhibits excellent fluidity after mixing; its application time can be adjusted according to temperature, and it cures deeply at room temperature. This product is suitable for the encapsulation and protection of various heat-dissipating, high-temperature-resistant components and fully complies with the EU RoHS Directive as well as the SVHC and REACH requirements. Its key characteristics include:

Dual-component addition-curing silicone rubber

1:1 Mixing Ratio

Low hardening shrinkage rate

Excellent high-temperature electrical insulation properties and stability

application area :

Automotive electronics & modules

LED Power Supply Drive Module

Solar module junction box

Electric Vehicle Charging Pole Module

Lithium-ion battery pack, Capacitor pack

Magnetic sensing coil inverter

Pre-sclerosis characteristics

Test Item                                              | Test Standard                            | Component A                  | Component B
  Appearance                                        Visual inspection                        Gray viscous liquid     White viscous liquid
Viscosity (cps), 25°C GB/T 10247-2008 6000±1000                       5000±1000
Specific gravity, g/cm³, 25°C GB/T 15223-1994 2.65±0.05                         2.65±0.05
mixing ratio mass ratio A: B = 100: 100
Mixed viscosity (cps), 25°C GB/T 10247-2008 5000±1000
Mixed operation time (minutes) GB/T 10247-2008 30-50
Initial curing time (hours) GB/T 10247-2008 3-5
Sclerosis conditions GB/T 10247-2008 25°C/12 h or 70°C/60 min; 80°C/30 min
Post-curing properties
Sclerotic lesion appearance visualization Gray elastomer
Hardness: Shore 00 GB/T 531-2008 30-60
Thermal conductivity, W/mK GB/T 10297-1998 2.0±0.1
Tensile strength, MPa GB/T 528-1998 >0.3
elongation,% GB/T 528-1998 >50
Linear expansion coefficient, K⁻¹, ppm HGT 2625-1994 150
Dielectric strength, kV/mm GB/T 1695-2005 >15
Volume resistance, DC 500 V, Ω·cm GB/T 1692-92 1.2×1013
Dissipation factor (1 MHz) GB/T 1693-2007 0.01
Dielectric constant (1 MHz) GB/T 1693-2007 5.8
Temperature range, °C GBT 20028-2005 – 60 ∽ 200
PS: The curing time and operating time were tested using a rubber mixing quantity of 100 g.
All data for the cured state were measured after the adhesive had been cured for 7 days under conditions of 25°C and 55% RH.

Operational Procedure

Before applying the adhesive, mix Components A and B thoroughly in their respective packaging; this is necessary because the fillers in the adhesive may partially settle during storage.

Weigh Groups A and B in a 1:1 ratio, mix them thoroughly, and then directly inject the mixture into the components (or modules) that require encapsulation protection.

matters need attention

Vacuum degassing of the mixed A/B components can enhance the performance of the hardened product.

For large quantities of A or B filler materials, ensure they are thoroughly mixed separately before weighing.

An excessively low temperature will result in a slower curing rate, while an excessively high temperature will lead to a faster curing rate; it is recommended to maintain a constant temperature in the workshop.

packing specifications

Pour the liquid slowly along one side of the container’s wall to minimize bubble formation.Allow the encapsulated components to stand still, allowing the bubbles to dissipate naturally; once the bubbles have largely disappeared, heat curing can be applied, or the components may be cured directly at room temperature – this process typically takes approximately 5–6 hours.For potting equipment requiring quantitative potting application, please contact our Company’s Marketing Department.

JOMS1850-20 may exhibit difficulty in hardening when in contact with materials containing sulfur, amines, organotin or unsaturated hydrocarbon plasticizers; common examples include rosin and natural rubber; therefore, a test should be conducted prior to use.

JOMS1850-20 High Thermal Conductivity Encapsulating Silicone; Order Codes: A 1850233, B 1850241

Component A: 2.5 kg per can, 15 kg per plastic drum

Component  B: 2.5 kg per can, 15 kg per plastic drum

Storage and Transportation

This product should be stored in a cool, dry environment at a temperature not exceeding 35°C; the shelf life is 1 year when stored at a temperature below 25°C.

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