2-Part Clear epoxy adhesive thin layer Potting Compound

product description

JOME 3108 A/B series is a two-component solvent-free normal temperature curing epoxy structural adhesive, low viscosity, high hardness, chemical resistance and excellent mechanical properties.

Product Features:

Low viscosity, good toughness
High transparency, no wrinkles on the surface
Excellent electrical insulation and stability
Good waterproof and moisture-proof
Operating temperature range-40 to 120℃

product details

2-Part Clear epoxy adhesive thin layer Potting Compound

product description

JOME 3108 A/B series is a two-component solvent-free normal temperature curing epoxy structural adhesive, low viscosity, high hardness, chemical resistance and excellent mechanical properties.

Product Features:

Low viscosity, good toughness
High transparency, no wrinkles on the surface
Excellent electrical insulation and stability
Good waterproof and moisture-proof
Operating temperature range-40 to 120℃

Technical parameters before and after curing:

Before solidification	test item	testing standard	unit	JOME 3108 A	JOME 3108 B
	pigment	Measures Measures	—	Colorless transparent liquid	Colorless transparent liquid
	dynamic viscosity	GB/T 10247-2008	25℃ , mPa ·s	5,000±1,000	120±30
	density	GB/T 13354-92	25℃ , g/cm3	1.14±0.05	1.00±0.05
	mixing ratio	mass ratio	Ratio=A:B	2 : 1
	Mix viscosity	GB/T 10247-2008	25℃ , mPa ·s	1, 100±300
	operate time	GB/T 10247-2008	25℃ , min/150g	50
After solidification	hardness	GB/T 531.1-2008	Shore D	80-90
	shear strength	GB 6328-86	MPa， Fe-Fe MPa, AL-AL	≥13 ≥10
	glass state temperature	GB/T 22567-2008	℃	75
	Loss factor	GB/T 1693-2007	（1MHz） (25℃)	0.05
	punch through voltage	GB/T 1693-2007	Kv/mm	20
	dielectric constant	GB/T 1693-2007	（1MHz） (25℃)	3.1
	volume resistivity	GB/T 1692-92	DC500V,Ω · cm	2.00E +14
	end-use temperature	GBT 20028-2005	℃	-40–120

Note: 1. The curing condition of the above data test is 80dc/1h.

2.The data in the table is the measured data under a specific condition for reference only, and it is not guaranteed that the data obtained by customers in the actual use process can be completely consistent with it.

Operational procedures

Molding: weigh and mix component A and B in a weight ratio of 2:1, and then carry out potting after mixing.

The operation time of this product is short. If the amount of mixing is large, it is recommended to mix more times.

If necessary, the filled device can be evacuated to improve the electrical performance of the device.

Curing conditions: 80℃/1h or 25℃/24h. If you need to use the filling equipment, please consult our marketing department.

Packaging and storage

Components A and B should be stored in a light and heat free and sealed (can be transported and stored as non-hazardous goods); the storage period is one year.