String inverter adhesive application point

String inverter adhesive application point

Encapsulation: Thermal conductive encapsulation for inductors – provides insulation protection and extends service life.
JOMS5230 Series A/B High Thermal Conductivity Encapsulating Silicone
Features: 1:1 mixing ratio, viscosity of 3800–4500 mPa·s, flame retardant rating V-0, RTI = 150°C
Hardness: Shore A 20–30; excellent noise absorption performance; thermal conductivity: 1.0–2.0 W/m·K; low hardening shrinkage rate

Fixation: Component reinforcement fixation
JOMS5337 Thermal Conductive Silicone Sealant (0.8 W/m·K)
Characteristics: Paste consistency; surface drying time <10 minutes; excellent adhesion to PVC, TPE and other polar plastics; stable mechanical and electrical properties over the temperature range of-60°C to 200°C.

Housing sealing: Adhesive bonding of the housing to enhance sealing performance.
Recommended model: JOMS5 336 Silicone Sealant
JOMS5 337 Thermal Silicone Sealant

String inverter adhesive application point

Overcoat coating: PCB three-proof protection
Recommended model: JOMS5062 – Silicone Resin
JOMS5 060 UV Moisture Curing
Features: Single-component, low viscosity, eco-friendly, compliant with UL flame retardancy standards

Structural bonding: Bonding and securing of structural components such as inductive coils
Recommended model: JOME2 011 – Two-component epoxy structural adhesive
Feature: 1:1 mixing ratio; the paste exhibits slight sagging; provides excellent adhesion for PBT, PA, PCB boards, coils, and nanocrystalline materials.

Thermal conductivity: Heat dissipation for the IGBT base module
Recommended model: JOMG2130-2135 Thermal Conductive Silicone Grease
Characteristics: Thermal conductivity of 3.0–3.5 W/m·K; temperature resistance ranging from-55°C to 200°C; suitable for printing processes.

Micro-inverter encapsulation schematic diagram

Two-step method:
Above 1000W
Open-type potting application

one-step method:
Below 800 W
Use of epoxy resin filling via injection port

Microinverter adhesive application point

Encapsulation material
Recommended product: JOMS523-0 Self-adhesive Thermal Conductive Flame-Retardant Encapsulating Sealant
Features: 1:1 mixture; after curing, penetration depth (1/10 mm) ranges from 30 to 50; surface is tacky; exerts an adsorption force on wiring harnesses and housings.
Thermal conductivity: 0.6; compliant with EU RoHS Directive and SVHC/REACH requirements; flame retardant (UL 94 V-0); RTI = 150°C.

sealing material
Recommended product: JOMS5 096 Silicone Adhesive Sealant
Characteristics: Paste-like consistency without sagging; no primer required; excellent adhesion performance; free of tin catalyst; excellent compatibility with addition-curing silicone rubber.

Microinverter adhesive application point

Weld joint protection
Recommended product: JOMS 5910 Silicone Adhesive Sealant
Characteristics: Low viscosity, self-leveling property, covers solder joints, ensures no contact between flux and potting compound.
Demonstrates excellent sustained thermal stability (-55–200°C) and good compatibility with addition-curing silicone rubber.

Heat Conduction Material
Recommended product: JOMS Series Thermal Conductive Gel
a. 1915/1925 AB Liquid Thermal Conductive Joint Compound
b. Single-component thermal conductive gel (35# & 50#)
Features: Low stress, low hardness and mild viscosity; compliant with ROHS and REACH certifications; thermal conductivity: 2/2.5/3/6 W/m·K

Gasket Compatibility Test

RTV 5910, RTV5096, and TCMP 1915 exhibit excellent compatibility when directly contacting curable potting compounds, demonstrate good curing performance, and are non-toxic.

Micro-inverter – Low-Stress Self-Adhesive Silicone Encapsulant JOMS5230 – Specifications

JOMS5230 Self-adhesive pouring sealant

Comparison of JOMS 5230 with high-elasticity potting compound (after thermal shock testing)

(High-Elasticity Resin Sealant – SHORE A 55)

(JOMS523-0: Penetration depth 1/10 mm; Range 30–50）

After undergoing a thermal shock test ranging from-40°C to +100°C, the bonding interface between the high-elastic encapsulant and the housing exhibited delamination, making it highly susceptible to moisture and water ingress, which can lead to abnormal electrical performance. In contrast, JOMS5230 maintained its adhesion properties. This is a key factor explaining why JOMS5230 self-adhesive encapsulant can pass the IP68 waterproofing test!

Energy Storage Module

Energy storage module adhesive dots

Cell bonding and bottom thermal bonding
Recommended model: Two-component polyurethane structural adhesive
JOMP2 110 (Non-thermal)
JOMP2650 (Thermal conductivity: 1.2–2 W)