Chip package encapsulation
COB （Chip on Board)
JOME1761
JOME1730
Edgebond /Cornerbond
JOME 1738-1
JOME 1761
filling
JOME 1761
0.7 – 15mm thicknesses can all achieve perfect coverage. It can undergo multiple 260℃ reflow soldering processes.
Low volatility. The chip is firmly bonded without cracking.
Chip cooling
The chip uses a single component thermal conductive gel, JOMS 3335
• JOMS series, post-curing (heated/ambient curing)
• No volatilization
• Good adhesion
• Long term high reliability
• Thermal conductivity wattage: 3~8w/mK
• Temperature resistance-40~200℃
Thermal conductive adhesive single-component RTV silicone sealant is used for bonding and fixing of electronic components on the PCB board.
JOMS5316,5317,5339
Cream-like non-settling single-component RTV silicone sealant is used for damming protection of electronic components on the PCB board.
JOMS5106B，JOMS5339
The flowable one-component RTV silicone sealant is used to apply a protective layer on the surface of the PCB board, providing waterproofing, dust prevention, and anti-static interference protection.
JOMS521，JOMS5060
