2K High-Temperature Resistant Epoxy Structural Adhesive

The JOME 2029A/B epoxy adhesive is a room-temperature/heat-cured resin adhesive. This two-component adhesive is designed for metal bonding, bonding of modular cabin or SMC fiberglass components, aluminum honeycomb panel assembly, magnetic steel tile bonding in motor products, ceramic membrane module sealing, internal structural bonding of lithium battery modules, soft magnetic unit potting, and high-temperature resistant sensor potting applications.

product details


product description
The JOME 2029A/B epoxy adhesive is a room-temperature/heat-cured resin adhesive. This two-component adhesive is designed for metal bonding, bonding of modular cabin or SMC fiberglass components, aluminum honeycomb panel assembly, magnetic steel tile bonding in motor products, ceramic membrane module sealing, internal structural bonding of lithium battery modules, soft magnetic unit potting, and high-temperature resistant sensor potting applications. The JOME 2029A/B epoxy adhesive can cure at room temperature and under heating conditions. After thorough mixing of Component A and Component B in a 100:50 (weight ratio), the product cures within a specified time frame to form a protective layer. Technical parameters before and after curing:				The cured adhesive exhibits the following properties: Highly resistant to moisture, contaminants, and other atmospheric components, with excellent adhesion. Exhibits excellent anti-contamination properties, requires minimal surface pretreatment, is solvent-free, and produces no curing by-products. Exhibits excellent resistance to extreme temperatures, with stability in transformer oil at-50°C to 200°C and minimal degradation. Exhibits excellent adhesion to fiberglass cloth, aluminum materials and plastics, aluminum materials with each other, and steel plates.
Before solidification	test item	testing standard	unit	Part A Part B
	pigment	Visual Inspection Visual Inspection	—	Black, Gray-White
	surface	Visual Inspection Visual Inspection	—	Non-sticking paste; Non-sticking paste
	dynamic viscosity	GB/T 10247-2008	25℃ , mPa ·s	190,000±30,000 70,000±30,000
	density	GB/T 13354-92	25℃ , g/cm3	1. 10±0.05 1.10±0.05
	mixing ratio	mass ratio	Ratio=A:B	100 ：50
	mixing ratio	volume ratio	Ratio=A:B	100 ：50
	Mixed viscosity	GB/T 10247-2008	25℃ , Pa ·s	150,000±30,000
	operate time	GB/T 10247-2008	25℃ , 100g， min	70±10
After solidification	hardness	GB/T 531.1-2008	Shore D	80±5
	Next is the strength.	GB 6328-86	Kgf/cm², iron/iron	240
	Next is the strength.	GB 6328-86	Kgf/cm², aluminum/aluminum	226
	T-type peel strength	GB/T2791-1995	N/mm(25℃)	6
	impact strength	GB/T 1843-2008	KJ/m2	15
	glass-transition temperature	GB/T 22567-2008	℃	110
	coefficient of expansion due to heat	GB/T 20673-2006	μm/m/℃	<Tg, 45 >Tg, 152
	Thermal pyrolysis temperature	TGA 10℃/min	℃	290
	water absorption	GB/T 8810-2005	24h， 25℃ , %	0.45
	dielectric strength	GB/T 1693-2007	kV/mm（25℃)	22
	insertion loss	GB/T 1693-2007	（1MHz） (25℃)	0.006
	dielectric constant	GB/T 1693-2007	（1MHz） (25℃)	3.1
	volume resistivity	GB/T 1692-92	DC500V,Ω · cm	5.20E +14

Note: 1. The curing conditions tested for the above data are 80°C for 1 hour.

Operation Process

Mixing: First, thoroughly stir Group A within its original packaging. Then, weigh and mix Groups A and B in a weight ratio of 100:50.

Mix thoroughly, then perform vacuum defoaming before use; consume within 80 minutes.

For properly sealed devices, vacuum extraction may be continued if necessary, which enhances their electrical performance.

Curing conditions: 80°C for 1 hour, 40°C for 16 hours, or 25°C for 24 hours.

For inquiries regarding the use of resin filling equipment, please contact our company’s marketing department.

Dual-tube packaging (2:1 volume ratio): Apply adhesive directly using a glue gun. Squeeze out the 5–10 cm of adhesive from the front end of the mixing tube before use.

List of adhesion strengths for different substrates

Substrate type	shear strength Mpa
ABS	4.2	Substrate damage
PVC	2.5	Substrate damage
PET	2.1	Substrate damage
nylon PA	3.8	Substrate damage
Epoxy resin plate	24.5	Substrate damage

Packaging and Storage

Component B should be stored protected from light, heat, and kept sealed (it can be transported and stored as a non-hazardous material); the shelf life of AB is one year.

Component A: 20 kg per plastic bucket; Component B: 10 kg per plastic bucket

50ml dual-tube (2:1 volume ratio), black;

400ml dual-tube (2:1 volume ratio), black;