General-purpose epoxy potting compound (black, white, red, clear)

JOME 31xx Series of Epoxy potting compound is a high-strength, high-electrical-performance and high-gloss surface adhesive material made by mixing epoxy resin with curing agent. Due to its relatively low price, it is widely used in the automotive industry, consumer electronic product components, wind power equipment, aerospace and other fields. It has excellent long-term high-temperature resistance and corrosion resistance, and has excellent stability.

product details

JOME 31XX Series of epoxy potting compound

PRODUCT FEATURES AND TYPICAL USE

ITEM NO APPLICATION PERFORMANCE

CHARACTERISTICS

 

3102

General purpose

For general electronic components potting and circuit board closure.

Room temperature can be cured, curing process exothermic temperature is low, low shrinkage

Cured bright surface,

no cracking, moisture,

insulation

 

3105

Thermal type

For high-power electronic components on the heat requirements of the

higher modules and circuit board potting protection.

After the glue has cured heat dissipation,

and other properties, like 3102

 

3108

Transparent type

Required for a transparent potting of electronic components and modules,

particularly for use in normal lighting requirements transparent potting

Room temperature curing, curing after the high

transparency,

other properties ,like 3102

 

3115

Heat-resistant type

For general heat-resistant electronic components potting and circuit

board closed

Mixing glue after a long time to use, heated at 80  ℃ in 2 to 3  hours full curing, and could be  used at temperature 180  ℃ .
3112

Flame       retardant

type

For the requirements of flame retardant small and medium-sized electronic

devices potting and circuit board closed, such as  capacitor enclosures, solid state relay potting, etc

 

Otherproperties like 3102

OPERATION PROCESS

Item 3102 3105 3108 3115 3112
Mix ratio, Mass ratio 5:1 5:1 2:1 7:1 5:1
Pot Life, hr ,25℃,100g >0.5 0.5 0.5 >0.5 0.5
Fixing Time, hr,25℃ 4~6 6~8 4 ~ 6 80℃ below 2~3 4~6
Full cure time, hr, 25℃ 24 24 24 24 24
  1. Mix the glue: the glue componentin the original packaging after the full mixing (no filler can not stir), the A and B components according to the provisions of the quality ratio of mixing (see the table above the mixing ratio), stir even after potting, The time available after mixing is shown in the table above. More than the available time, glue viscosity will be high, no longer suitable for perfusion. So each time with the amount of plastic should not be too much, otherwise it will cause a waste.
  2. Curing:Cure conditions See table above. Curing speed and temperature related, high temperature fast curing, winter temperature is low, curing time will be extended, a variety of plastic can be used curing curing method, at 80 ℃ under the conditions of curing 2 to 3 hours. After the hardening of the glue can be assembled, the test generally need to cure 24 to 48 hours after the. TYPICAL PROPERTIES
    Item/ Method 3102 3105 3108 3115 3112
    Appearance,

    Visual

    inspection

    A Black viscous fluid Black viscous fluid Colorless transparent fluid Black viscous fluid Black viscous fluid
    B Brown liquid Brown liquid Transparent liquid Transparent liquid Brown liquid
     

    Density, g/cm3 25℃

    A 1.85 ~1.95 1.85 ~1.95 1.05 ~1.15 1.40 ~1.50 1.60 ~1.70
    B 1.05 ~1.15 1.12 ~1.15 0.94~0.96 1.10 ~1.15 1.05 ~1.15
    After

    mixing

    1.55~1.65 1.55~1.65 0.99~1.05 1.40~1.50 1.50~1.60
     

    Viscosity, cps

    25℃

    A 20000~30000 10000~20000 400~500 20000~30000 30000~40000
    B 100~200 500~800 50 ~150 40 ~120 100~200
    After

    mixing

    1000~1500 1500~3000 100~300 2000~4000 2000~4000
    After mixing Pot Life, min 30-50 20-40 20-40 40-60 30-50
    Hardness ,Shore-D >80 >80 >75 >80 >80
    Volume resistivity,Ω.cm,25℃ 1.0×1014 1.0×1014 1.0×1014 1.0×1014 1.0×1014
    Breakdown voltage,kV/mm,25℃ >18 >18 >18 >18 >18
    Dielectric constant,1.2MHz,25℃ 3.1±0.1 3.2±0.1 3.3±0.1 3.1±0.1 3.3±0.1
    dielectric             loss             angle

    tangent,1.2MHz

    <0.01 <0.01 <0.01 <0.02 <0.01
    Cure shrinkage,% <2 <2 <2 <0.8 <2
    Thermal conductivity ,W/K.m 0.35 1.0 0.27 0.7 0.5
    Shear strength, Fe-Fe,    MPa >7 >7 >7 >7 >10
    Use temperature range,℃ -40 ~120 -40 ~120 -40 ~100 -40 ~180 -40 ~120
    ITEM NO CODE NO COMPOSITION PACKING
    JOME 3102 Black epoxy potting 0306000 Part A 25kg/ barrel
    Part B 5kg/ pot
    Part A 5kg/ barrel
    Part B 1kg/bottle
    JOME 3102 W White epoxy potting 0306010 Part A 25kg/ barrel
    Part B 5kg/ pot
    JOME 3105 Black thermal conductivity epoxy potting 0306100 Part A 25kg/ barrel
    Part B 5kg/ pot
    JOME 3108 Transparent epoxy potting 0306110 Part A 10kg/ pot
    Part B 5kg/ pot
    JOME 3105 Black heat-resistant potting epoxy 0306090 Part A 14kg/ barrel
    Part B 1kg/bottle
    JOME 3112 Black flame retardant epoxy potting 0306030 Part A 25kg/ barrel
    Part B 5kg/ pot

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