JOME adhesive product characteristics:
● Excellent thermal stability
● Extremely low moisture absorption
● Adjustable modulus
● Low ion content
● Excellent optical performance
● Adhesion to most materials
● No by-products● Extremely low shrinkage
LED packaging materials
| product classification | gel | elastic body | |||||
| product model | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 | JOMS 3512 |
| refractive index | 1.41 | 1.52 | 1.41 | 1.41 | 1.52 | 1.52 | 1.52 |
| distinguish | Upon curing, it forms a very soft material. | Upon curing, it forms a strong and elastic material. | Upon curing, it forms a hard and durable material. | ||||
| Adhesion | good | good | fine | fine | fine | good | good |
| apply | Fluorescent powder mixture, lens filling | Lens filling, COB integration | Lens Mold Resin | ||||
Bulb Light
| Application Point | Adhesive seed | model | characteristic |
| Light bulb cover bonding and fixation | silica gel | JOMS5336T | Transparent, yellowing-resistant |
| Epoxy structural adhesive | JOME3117 | Quick-drying with strong adhesion | |
| Aluminum substrate thermal conductivity | Thermal grease | JOMSG2101、2125 | Thermal conductivity: 1.2 and 2.5 W/(K·T) |
| Thermal silicone gel | JOMS5316 | Adhesive strength; thermal conductivity values: 0.8 and 1.5 | |
| Circuit section thermal sealing | Thermal silicone gel | JOMS5230 | 1:1 ratio; excellent fluidity; thermal conductivity: 0.8 |
| Thermal silicone gel | JOMS5300 | 10:1 – Excellent adhesion; thermal conductivity: 0.8 | |
| polyurethane | JOMP2605 | 5:1; flame retardant; thermal conductivity: 0.6 |
Starlight Lamp
| Application Point | Adhesive seed | model | characteristic |
| Light bulb cover bonding and fixation | silica gel | JOMS5336T | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| Aluminum substrate thermal conductivity | Thermal grease | JOMSG2101、2125 | Thermal conductivity: 1.2 and 2.5 W/(K·T) |
| Thermal silicone gel | JOMS5316 | Adhesive strength; thermal conductivity values: 0.8 and 1.5 | |
| PCB board encapsulation | Silicone encapsulant | JOMS5115Y | 100:10:1 – Matte black – High toughness |
| Silicone encapsulant | JOMS5125T | 10:1 – High light transmittance | |
| Circuit section thermal sealing | polyurethane | JOMP2605 | 10:1 – Excellent adhesion; Thermal conductivity: 0.8 |
projector
| Application Point | Adhesive seed | model | characteristic |
| Light bulb cover bonding and fixation | silica gel | JOMS5336T | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| Lens bonding and fixation | silica gel | JOMS5338H | Transparent, resistant to yellowing, excellent adhesion, and does not turn white. |
| Terminal lead bonding and fixation | silica gel | JOMS5321 | Single-component formula – quick drying, excellent toughness |
| Circuit section thermal sealing | silica gel | JOMS5300 | 1:1 ratio; excellent fluidity; thermal conductivity: 0.8 |
Lightweight bricks
| Application Point | Adhesive seed | model | characteristic |
| PCB and optical brick bonding and fixation | silica gel | JOMS5336T | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| PCB backside fill buffer layer | polyurethane | JOMP2010 | Transparent, resistant to yellowing, and possesses excellent adhesion. |
| Terminal lead bonding and fixation | silica gel | JOMS5321 | Single-component formula – quick drying, excellent toughness |
Line Light
| Adhesive seed | characteristic | ||
| Light source and PCB encapsulation | silica gel | JOMS5125T | 10:1 – High light transmittance, excellent toughness, and strong adhesion to aluminum frames |
| End cap and lens bonding and fixation | silica gel | JOMS5338H | Single-component, transparent; resistant to yellowing; excellent adhesion; does not turn white. |
| Glass top cover bonding | silica gel | JOMS5336T | Single-component, transparent, yellowing-resistant, and high adhesion performance |
| | silica gel | JOMS5125W/B | 10:1 – Black, White – High toughness |
| silica gel | JOMS5300W | 10:1, White, Thermal Conductivity: 0.8 | |
| Terminal lead bonding and fixation | silica gel | JOMS5321 | Single-component formula – quick drying, excellent toughness |
| Circuit section thermal sealing | silica gel | JOMS5230 | 1:1 ratio; excellent fluidity; thermal conductivity: 0.8 |
Underwater lights, buried lights
| Adhesive seed | model | characteristic | |
| silica gel | JOMS5311T | Single-component, transparent; fast surface drying time; excellent toughness. | |
| Guardrail pipe – PCB thermal conductivity | Thermal insulation gasket | JOMG-340 | Thermal conductivity: 1.0; suitable for single-or double-sided adhesive application. |
| Soft light strip – epoxy resin | epoxide-resin glue | JOME1500 | 2:1 ratio; transparent; resistant to yellowing; excellent adhesion; high toughness |
| Application Point | Adhesive seed | model | characteristic |
| Sealing adhesive bonding for the frame and lead wires | silica gel | JOMS5311T | Single-component, transparent; fast surface drying time; excellent toughness. |
| Underground light strip encapsulation | epoxide-resin glue | JOME5108-3 | 2:1 ratio; matte white; high hardness |