2K Thermal conductive epoxy potting compound（1.5W）

JOME 2040A/B is a two-component solvent-free epoxy potting compound that cures at room temperature, with the option for heat-curable applications. This versatile material provides encapsulation protection for high-thermal-conductivity components such as motors, automotive electronics, power tools, reactors, chip heat sinks, and water-cooled radiators, delivering exceptional adhesion and temperature resistance.

Excellent bonding and crack resistance

Suitable for potting of various components

TWO COMPONENT, Medium VISCOSITY

Low CTE linear expansion coefficient

High thermal conductivity

Excellent electrical insulation and stability

It can be used for a long time at-50 to 180℃

The water absorption rate is very low, good waterproof and moisture-proof

product details

2K Thermal conductive epoxy potting compound（1.5W）

Product features and applications

Excellent bonding and crack resistance

Suitable for potting of various components

TWO COMPONENT, Medium VISCOSITY

Low CTE linear expansion coefficient

High thermal conductivity

Excellent electrical insulation and stability

It can be used for a long time at-50 to 180℃

The water absorption rate is very low, good waterproof and moisture-proof

Technical parameters before and after curing:

Before solidification	Test items test criteria unit PART A PART B
	Color measurement black liquid light yellow liquid
	Viscosity GB/T 10247-2008 25℃,mPa·s 40,000±10,000 100±50
	Density GB/T 13354-92 25℃,g/cm3 2.6±0.1 0.95±0.05
	Mix ratio mass ratio Ratio=A:B 100 ：5
	Mixing viscosity GB/T 10247-2008 25℃,mPa·s 6,000±1,500
	Operation time GB/T 10247-2008 25℃, min 60
After curing	Hardness GB/T 531.1-2008 Shore D 90
	Thermal conductivity GB/T W/mK 1.5
	Expansion coefficient GB/T 20673-2006 μm/ (m,℃)		25, < Tg 62, > Tg
	Glass transition temperature DSC ℃		95, curing 80℃ 3hr; 105, curing 120℃ 2hr;
	Cutting strength GB 6328-86 Cutting strength GB 6328-86	MPa ，Fe-Fe MPa，Al-Al	≥10 ≥8
	Dielectric strength GB/T 1693-2007 kv/mm (25℃) ≥18
	Loss factor GB/T 1693-2007 (1MHz)(25℃) 0.09
	Dielectric constant GB/T 1693-2007 (1MHz) (25℃) 3.1 3.1
	Volume resistance GB/T 1692-92 DC500V, Ω · cm 1.00E +15
	Use temperature GBT 20028-2005 ℃ -50–180

Note: 1. The curing condition of the above data test is 80℃*3h

2. The data in the table are measured data under a certain condition for reference only, and there is no guarantee that the data obtained by customers in the actual use process can be completely consistent with it.

Operational process

Dispersion: Because the filler contained in component A will precipitate with the time of storage, the component A is mixed evenly in the original packaging before use, and then component A and B are weighed and mixed in a weight ratio of 100:5, and then filled.

Component B exposed to air will react with moisture and hydrolysis phenomenon occurs. The hydrolysis product is a white powder. Try to avoid pouring in the white substance when weighing.

If necessary, the sealed device can be evacuated to improve the electrical performance of the device.

Curing conditions: 25℃*24 hours. For better performance, follow the curing process of 100℃*2 hours or 80℃*3 hours.

If you need to use the filling equipment, please consult our company’s marketing department.

matters need attention

If the amount of component B of curing agent is more or less than the normal proportion, the hardness of the product at high temperature will be reduced.

The greater the difference in the amount of component B of curing agent, the greater the change in the hardness of colloid and the worse the temperature resistance.

Packaging and storage

Component B should be stored in a light and heat free and sealed (can be transported and stored as non-hazardous goods); the storage period is one year.

Component A: 10kg/plastic barrel; Component B: 0.5kg/pot.