New energy vehicle thermal management solution

Classification of Automotive Thermal Management Equipment

Electronic water pump

Water pump frame seal
Water pump controller housing bonding
-40/120C
N9339
Single-component, paste consistency. Surface dry in 15 minutes.
Temperature resistance: -60/300°C
CIPG/FIPG Applicability
Water pump heating element heat dissipation
TCMP 19 25
2.5W thermal expansion joint compound
1:1, V0, Temperature range: -60°C to 200°C

Electronic water pump

Metal housing wiring terminal encapsulation
6225-007 Epoxy Resin
100:25 Two-component epoxy resin
Temperature resistance up to 150°C; V0
High hardness D80
High bonding strength> 10 MPa
client
Hefei Xinhu, Zhejiang Xinjie, Sanhua, Megmite, Ruiju, Huayang

electric fan

PMWmodule
Plug connector bonding and sealing
EP 17 62
monocomponentEP
Reduce mechanical stress
Temperature resistance: -60–260°C
Power module heat dissipation
TCMP 1920
1:1 mixture – thixotropic material
Thermal conductivity: 2 W/m·K

electric fan

fan cooler
Internal coil encapsulation
PUR 161 8
0.8 W thermal conductivity, low viscosity
Flame retardant (V0, A85)
Dual 8500mAh battery – 500 hours of runtime – Excellent sealing performance
client
BorgWarner

Liquid cooling plate

Liquid-cooling plate with copper tube filling
High thermal conductivity and low viscosity required
High mechanical strength
EP 1716
100:5 – Epoxy resin
Viscosity: 6000 cPs
Can be cured at room temperature
Low-stress CTE = 25
1.5W/mk
client
Vertical Line

Electronic expansion valve

Electronic expansion valve filling/demolding
Curing and demolding followed by molding
EP 1788
Two-component room-temperature curing epoxy resin
CTE=36 – Low thermal expansion coefficient
Hardness D90, high mechanical strength
Thermal conductivity: 0.56 W/m·K
Excellent aging resistance

PTCcalorifier

Heater frame seal
SIPC 9133
Excellent high-temperature resistance – up to 315°C
High bonding strength: Fe/Fe = 2 MPa
Plugin section encapsulation
SIPA 82 5 0
1:1 additive bonding
Thermal insulation and flame retardancy
Power module heat dissipation
TCMP 1920
1:1 mixture; thixotropic material
Thermal conductivity: 2 W/m·K

Electronic water pump

Water pump outlet seal
SIPC 9400
1:1 two-component, semi-liquid
Drying time: 10–15 min
A30 – Operating temperature range: -60°C to 200°C

48V BSG Module

Internal cavity potting
BEGEL 8606
1:1 Two-component silicone gel
Impact-resistant and self-healing
Temperature resistance: -50/220°C
Plug connector bonding and sealing
EP 1762
monocomponentEP
Reduce mechanical stress
Temperature range: -60°C to 260°C
Power module heat dissipation
TCMP 1920
1:1 mixture; thixotropic material
Thermal conductivity: 2 W/m·K