SMT epoxy base surface mount red adhesive

Product profile

JOME8222 Is the single liquid type epoxy resin used by the chip.This resin has medium viscosity, high shaking and fast curing at

low temperature. This product can be used in the printing process and dispensing process without drawing and collapse. The

hardening surface of this resin will not have greasy phenomenon,the hardening material has good subsequent strength, electronic

insulation, chemical resistance and solvent resistance, for a variety of surface adhesion components can produce a stable adhesive

effect. This product is suitable for the subsequent and packaging of chips and electronic components.

Product features

1. This resin is a solvent-free single-liquid epoxy resin.
2. This product has good electronic insulation characteristics under the high humidity condition.

3. This resin has good low stress, low shrinkage rate and low water absorption rate.

4. This product has medium viscosity and high touch degeneration, in the process of processing and hardening.

5. This resin can simultaneously reduce the working time and improve the work efficiency.

6. This product complies with the 2002 / 95 / EC RoHS regulatory specifications.

7. This product complies with chlorine <900ppm, bromine <900ppm, and chlorine + bromine <1500ppm.

Resin specifications

JOME8222

surface                                                                       Mucky liquid

pigment                                                                             red

Viscosity 25 oC, S14,10rpm, and cps            80,000~150,000

thixotropic index                                                             >6

Liquid proportion                                                         1.32

Sclerosis conditions

Time 25 oC, days                                                        7

Recommended oven baking time of 120 oC, min   10~15

Recommended oven baking time of 130 oC, min    5~10

Recommended oven baking time of 150 oC, min    3~5

Recommended complete curing time (heating plate)  120 oC, sec 130

Recommended complete curing time (heating plate)  150 oC, sec 100

Recommended complete curing time (heating plate)   180 oC, sec 90

The above are all Bonding-line Temp

Finished product properties *

Glass transfer temperature (TMA), oC                                125

Coefficient of thermal expansion (<Tg), μ m / m /oC         64

Coefficient of thermal expansion (> Tg), μ m / m/ oC        215

Hardness (Durometer) of the Shore                                    D86

Specific gravity (20 / 20 oC)                                                1.35

cubical contraction,%                                                            <3

Water absorption (25 oC / 24hr),%                                     0.23

Water absorption rate (80 oC / 24hr),%                             1.50

Water absorption rate (97 oC / 1.5hr),%                            0.60

Shear strength of * 2 Copper vs. Al, kg / cm2                  316

Element thrust strength, 25 oC,

Kg0603+FR4             2.9

Diode + FR 4             2.4

IC +FR4                      7.8

MLCC +FR4              3.7

Thermal thrust strength of the element, 0805,25oC, kg      3.4

Complement thermal thrust strength, 0805,80 oC,kg         3.8

Thermal thrust strength of the element, 0805,120oC, kg    3.3

Component thermal thrust strength, 0805,180 oC,kg          1.7

Thermal thrust strength of the element, 0805,240oC, kg    1.1

Component thermal thrust strength, 0805,280 oC,kg         0.9

Pyrolysis temperature (TGA 10oC / min), oC                        337

Specific heat of 0 oC, and J / goC                                       4.43

Specific heat of 25 oC, and J / goC                                     4.56

Specific heat of 50 oC, and J / goC                                     4.80

Specific heat of 75 oC, and J / goC                                     5.04

Specific heat of 100 oC, and J / goC                                   5.20

Weight loss rate @ 100 oC,%                                               0.65

Weight loss rate @ 150 oC,%                                               0.79

Weight loss rate @ 200 oC,%                                               2.27

Weight loss rate @ 250 oC,%                                               2.71

Weight loss rate @ 300 oC,%                                               3.53

Weight loss rate @ 350 oC,%                                               5.92

Thermal conductivity coefficient, W / mK                            0.35

Thermal impedance coefficient, m2K / W                            0.01

sheet resistance,ohm                                                            4.5*1014

Volume resistance, ohm-cm, raw value                            4.5*1015

Volume resistance, ohm-cm, 100 oC * boiled * 2HR       3.3*1015

Volume resistance, ohm-cm, raw value                             3.2*1014

Volume resistance, ohm-cm, 40 oC * 95% RH * 100V * 96 Hr,2.2*1014

Volume resistance, ohm-cm, raw value                             3.8*1014

Volume resistance, ohm-cm, 85 oC * 85% RH * 50V * 1000 Hr2.4*1014

Dielectric constant, 100 KHz                                                 4.1

The dielectric constant, at 1 MHz                                         3.9

Dielectric constant, 10 MHz                                                  3.8

Dielectric constant, 100 MHz                                                3.7

Dielectric strength, and KV / mm                                            22

* 1 Test conditions: 150 oC / 3min

* 2 Cross-sectional area of round piece: thickness 3mm x 25mm diameter

* 3 Surface resistance, volume resistance value, practical applied insulation data will not be lower than 1012 power

* 4 The test piece thickness increases, the curing time increases, the reaction rate increases, the surface resistance, the power of the

volume resistance value rise

usage method

1. This product can be placed at room temperature (25 oC for 4hours) before use. Do not open the cover of this product

before the temperature returns, so as not to affect the properties of the resin.

2. The following surface of the resin shall be clean and clean. In the experiment, the surface can be wiped with organic solvent

to prevent dust, oil and film agent from affecting the subsequent utility of the product. For this rubber material

cleaning solvent, an ester solvent is recommended.

3. The hardening time of the actual item is affected by the following factors: ①the geometry of the object, the

material characteristics of the ② object, the thickness of the

③ subsequent agent, and the effectiveness of the ④ heating system. The hardened conditions need to be finally confirmed

by the actual items and conditions.

4. If applied to large area perfusion, it is recommended to prefix the product at low temperature Chemical, and then raise the temperature to becompletely cured, to avoid too intense reaction,resulting in material damage.

5. After the heat hardening process, the slow cooling of the product can reduce the internal stress of the product.