String inverter adhesive application point
String inverter encapsulation: Thermal conductive encapsulation for inductors – provides insulation protection and extends service life.
JOMS5230 Series A/B High Thermal Conductivity Encapsulating Silicone
Features: 1:1 mixing ratio, viscosity of 3800–4500 mPa·s, flame retardant rating V-0, RTI = 150°C
Hardness: Shore A 20–30; excellent noise absorption performance; thermal conductivity: 1.0–2.0 W/m·K; low hardening shrinkage rate
Fixation: Component reinforcement fixation
JOMS5337 Thermal Conductive Silicone Sealant (0.8 W/m·K)
Characteristics: Paste consistency; surface drying time <10 minutes; excellent adhesion to PVC, TPE and other polar plastics; stable mechanical and electrical properties over the temperature range of-60°C to 200°C.
Housing sealing: Adhesive bonding of the housing to enhance sealing performance.
Recommended model: JOMS5 336 Silicone Sealant
JOMS5 337 Thermal Silicone Sealant
String inverter adhesive application point
String inverter overcoat coating: PCB three-proof protection
Recommended model: JOMS5062 – Silicone Resin
JOMS5 060 UV Moisture Curing
Features: Single-component, low viscosity, eco-friendly, compliant with UL flame retardancy standards
Structural bonding: Bonding and securing of structural components such as inductive coils
Recommended model: JOME2 011 – Two-component epoxy structural adhesive
Feature: 1:1 mixing ratio; the paste exhibits slight sagging; provides excellent adhesion for PBT, PA, PCB boards, coils, and nanocrystalline materials.
Thermal conductivity: Heat dissipation for the IGBT base module
Recommended model: JOMG2130-2135 Thermal Conductive Silicone Grease
Characteristics: Thermal conductivity of 3.0–3.5 W/m·K; temperature resistance ranging from-55°C to 200°C; suitable for printing processes.
Micro-inverter encapsulation schematic diagram
String inverter guide—micro-inverter potting: two-step method:
Above 1000W
Open-type potting application
one-step method:
Below 800 W
Use of epoxy resin filling via injection port
Microinverter adhesive application point
Microinverter encapsulation material in this string inverter application guide
Recommended product: JOMS523-0 Self-adhesive Thermal Conductive Flame-Retardant Encapsulating Sealant
Features: 1:1 mixture; after curing, penetration depth (1/10 mm) ranges from 30 to 50; surface is tacky; exerts an adsorption force on wiring harnesses and housings.
Thermal conductivity: 0.6; compliant with EU RoHS Directive and SVHC/REACH requirements; flame retardant (UL 94 V-0); RTI = 150°C.
sealing material
Recommended product: JOMS5 096 Silicone Adhesive Sealant
Characteristics: Paste-like consistency without sagging; no primer required; excellent adhesion performance; free of tin catalyst; excellent compatibility with addition-curing silicone rubber.
Microinverter adhesive application point
This string inverter guide also covers microinverter weld joint protection
Recommended product: JOMS 5910 Silicone Adhesive Sealant
Characteristics: Low viscosity, self-leveling property, covers solder joints, ensures no contact between flux and potting compound.
Demonstrates excellent sustained thermal stability (-55–200°C) and good compatibility with addition-curing silicone rubber.
Heat Conduction Material
Recommended product: JOMS Series Thermal Conductive Gel
a. 1915/1925 AB Liquid Thermal Conductive Joint Compound
b. Single-component thermal conductive gel (35# & 50#)
Features: Low stress, low hardness and mild viscosity; compliant with ROHS and REACH certifications; thermal conductivity: 2/2.5/3/6 W/m·K
Gasket Compatibility Test
Gasket compatibility in this string inverter guide: RTV 5910, RTV5096, and TCMP 1915 exhibit excellent compatibility when directly contacting curable potting compounds, demonstrate good curing performance, and are non-toxic.
Micro-inverter – Low-Stress Self-Adhesive Silicone Encapsulant JOMS5230 – Specifications
Micro-inverter JOMS5230: self-adhesive pouring sealant in this string inverter guide
Comparison of JOMS 5230 with high-elasticity potting compound (after thermal shock testing)
(String inverter guide comparison: High-Elasticity Resin Sealant – SHORE A 55)
(JOMS523-0: Penetration depth 1/10 mm; Range 30–50）
After undergoing a thermal shock test ranging from-40°C to +100°C, the bonding interface between the high-elastic encapsulant and the housing exhibited delamination, making it highly susceptible to moisture and water ingress, which can lead to abnormal electrical performance. In contrast, JOMS5230 maintained its adhesion properties. This is a key factor explaining why JOMS5230 self-adhesive encapsulant can pass the IP68 waterproofing test!
Energy Storage Module
Energy storage module adhesive dots
Beyond string inverter bonding: energy storage cell bonding and bottom thermal bonding
Recommended model: Two-component polyurethane structural adhesive
JOMP2 110 (Non-thermal)
JOMP2650 (Thermal conductivity: 1.2–2 W)
BMS circuit board three-proof coating
Recommended model: (UL 94V-0)
JOMS5 062 Silicone Resin
JOMS5 060 UV Moisture Curing
Energy storage module adhesive application point
Energy storage in this string inverter guide: battery pack encapsulation protection
Recommended model: Sealing Compound
JOMP2608
JOMS5230-15
Pack casing bonding and sealing
Recommended model: Silicone Adhesive Sealant
JOMS5 096（ FIPG）
JOMS1830A/B（ CIPG）
Cell bottom thermal fixation
Recommended model: TCMP Gap filler
Thermal conductivity gap filler
Define each bonding location by its assembly duty
For each string inverter adhesive application point, identify whether the material transfers heat, restrains a component or protects an electrical interface. These functions can overlap, but they should not be assumed equivalent. A thermal layer beneath a power module must contact both mating surfaces, while a component-fixing bead must control movement under the relevant load. A cavity fill around an inductor can influence heat flow and mechanical stress as well as environmental protection. Mark the intended material region and any features that must remain open on the assembly drawing. Connector engagement areas, designated vents and service interfaces should be considered before choosing the dispensing path. Review whether a material can flow into an unintended location during assembly or cure. This is particularly relevant when a paste used for fixation sits beside a more flowable encapsulant. At the thermal interface, distinguish the small irregularities of mating surfaces from a larger dimensional gap. A grease interface needs suitable retention and contact in the surrounding mechanical design; a curing adhesive adds a different attachment and rework condition. The thermally conductive adhesives for assembly category supports the bonding version of that task, with the actual gap and heat path specified. Why compare thermal properties before confirming that the material will remain in contact at the required location? It’s more useful to review the assembled stack, including the heat sink and its downstream cooling path. Electrical protection also needs its own design checks. Bulk insulation properties do not establish every spacing or leakage requirement in the finished circuit. Inspect interfaces around terminals, leads and enclosure transitions, where moisture or separation can create an unwanted path. Where the material is intended to support a heavy component, review the load transmitted into the board and the effect of differential thermal movement. A fixing bead should support the component without interfering with other necessary functions. Keep the duty of each location explicit when evaluating candidate formulations, rather than describing the whole enclosure as a single potting problem.
Check material interactions and the filled enclosure
Qualification of a string inverter adhesive application point should reproduce the materials that meet there in production. An encapsulant may contact a board coating, a fixing bead, a cable jacket and the metal housing within the same cavity. Cure and adhesion must therefore be checked at those contact interfaces, as well as in a separate bulk specimen. If curing is incomplete only beside another material, investigate that interaction before changing the overall process. Some addition-curing silicones are sensitive to contamination, but the cure mechanism of the selected formulation must be identified rather than assumed from the word silicone. For mixed compounds, follow the documented preparation and dispensing method. The potting and encapsulating material category is a starting point for discussing fill behavior, cured compliance and the intended protective function. The actual enclosure geometry remains part of the evaluation. Air can become trapped beneath components or around narrow passages even when the visible upper surface looks fully filled. Inspect representative sections or use another suitable method to confirm contact at the locations that matter. Keep destructively examined specimens separate from those used for functional checks. Review the curing behavior in the intended fill geometry; reactive heat generation and restricted access for moisture or light can make a cavity behave differently from a thin open sample. Then compare electrical and thermal behavior before and after relevant environmental conditioning. Use the same operating and measurement conditions when assessing a change. Inspect whether the encapsulant has separated from the housing, whether a fixing bead has cracked, and whether the thermal interface has shifted. A loss of enclosure sealing should be traced through the complete leakage route, including cable entries and flange transitions, instead of being assigned automatically to the potting compound. Consider maintenance access during this work: a filled region that protects a component may also make replacement impractical. Document the fill sequence, contact materials, inspected sections and observed failure locations. That record helps determine whether a defect comes from the formulation, the interface or the way the inverter was assembled.
The full JOME product catalogue named above is one part of the JOME production line. For the earlier discussion of Five key applications of adhesives in the, follow the link, or browse the the complete JOME industrial adhesive line; specifications and samples go through the start a conversation with the JOME team.