Thermally Conductive Epoxy Potting Compound

A two-part, thermally conductive epoxy potting compound for electronic encapsulation and heat dissipation.

product details

JOME 3113-1 A/B

 High-temperature two-component epoxy potting

Apply for electronic componets

PRODUCT DESCRIPTION

JOME 3113-1A/B is a two-component solventless, room temperature curing epoxy potting material for  automotive,  automotive  electronics,  power tools,  reactors,  instruments  with  high  thermal  conductivity

requirements of the product package protection, and has excellent adhesion and heat resistance.

FEATURES

l Heat curing will bring high heat resistance

l Excellent adhesion, anti-cracking

l Low CTE linear expansion coefficient

l Having a high thermal conductivity

l Excellent electrical insulation, stability

l Long-term use at -50  ℃ – 200 ℃

l Very low water absorption, good waterproof, moisture resistance

TYPICAL PROPERTIES

 

Before cured

Item Method Unit JOME 3113-1 A JOME 3113-1 B
Appearance Visual inspection Black Liquid Beige paste
Viscosity GB/T 10247-2008 25τ , mPa ·s 20,000±3,000 25
Density GB/T 13354-92 25τ , g/cm3 2.35±0.05 0.93±0.05
Mix rate Mass ratio Ratio=A:B 100 :8
Mix viscosity GB/T 10247-2008 25τ , mPa ·s 2,000±300
Operation time GB/T 10247-2008 25τ , min 45
Gel time GB/T 10247-2008 60τ , min 60
 

After cured

Hardness GB/T 531.1-2008 Shore D 90
Thermal

conductivity

GB/T 10297- 1998 W/mK 1.2±0.1
linear thermal

expansion coefficient

GB/T 20673-2006 μm/( m ,τ) 20
glass transition temperature DSC τ 95

Apply for electronic componets

  Shear strength GB 6328-86 Mpa ,Fe-Fe ≥8
Shear strength GB 6328-86 Mpa ,Al-Al ≥8
Dielectric strength GB/T 1693-2007 kV/mm(25τ) ≥18
Loss factor GB/T 1693-2007 (1MHz)(25τ) 0.09
Dielectric constant GB/T 1693-2007 (1MHz)(25τ) 2.9
Volume resistance GB/T 1692-92 DC500V,Ω· cm 1.00E +15
Applying temperature GBT 20028-2005 τ -50– 200

Note:

  1. Theabovedata curing conditions tested were 100  ℃  * 2h
  2. The measured data table is under a specific condition, for reference, the resulting data does not guarantee that theclient can fully consistent with theactual use.

Operation process

l Preparation: Put A material original packaging barrels at 40℃ environment preservation 2 hours, after take out, compound viscosity is thinning, lower.

l Or use directly at normal room temperature.

l Mixing :With the A component of the filler will contain the time to precipitate down, so use a stirrer to make the filler and resin liquid mixed evenly.   ThenweighingA /  B components with  Ratio  100:8, mixingthoroughly for several minutes. After, the finished liquid will be ready for potting.

l Component B may occur during storage or agglomeration of crystal (a normal case), if required before use crystalline placed in an oven at 60 ℃to melt it, and then cooled to room temperature and after use, which does not affect its performance.

l The exposed component B will be hydrolyzed in moisture and the color of hydrolysate will show the color of white as friable powder.

l Good potting device, if necessary, vacuum may continue to help increase the electrical properties of

the device.

Apply for electronic componets

Curing conditions

Recommendedcuring process would be chosen as below:

25℃* 24h at room temperature

80℃ * 3h

100℃ * 2h,   reach the heat resistance grade B;

100 ℃ * 2h + 120  ℃ * 1h , reach the heat resistance grade F;

If working temperature is below 150 ℃ ,   the final curing temperature can be ignored.

Packing and Stocking

l Avoid the sun and heat, stock under sealing.

l Shelf life at 25τ: Part A 12 months, part B 12 months;

l If expired should be tested first.

l Part A :20kg/plastic drum;    Part B: 0.8kg/bottle or 2.4kg/pot

Limited warranty information—Please read carefully

The information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should not be used in substitution for customer’s tests to ensure that JOME  products are safe, effective,

and fully satisfactory for the intended end use.

Your  exclusive  remedy  for  breach  of  such  warranty  is  limited  to  refund  of  purchase  price  or replacement of any product shown to be other than as warranted.

For Immediate Assistance, Please Contact us Now!

hot-sale product

JM-2050 Thermally Conductive Epoxy Potting Compound (复制) (复制) (复制) (复制) (复制) (复制)
JM-2050 Thermally Conductive Epoxy Potting Compound (复制) (复制) (复制) (复制)
JM-2050 Thermally Conductive Epoxy Potting Compound (复制) (复制) (复制)
JM-2050 Thermally Conductive Epoxy Potting Compound (复制)

For Immediate Assistance, Please Contact us Now!