Specialists in Potting Compounds, Thermal & Epoxy Adhesives
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Hot Melt Adhesives

Solvent-free thermoplastic adhesives that bond in seconds on cooling — for fast, clean, high-volume assembly.

Fast, Solvent-Free Bonding

Hot melt adhesives are solid thermoplastics that are melted, applied and then set within seconds as they cool. They contain no solvents or water, bond a wide range of materials and are ideal for fast, automated, high-volume production.

JOME supplies hot melt adhesives and low-pressure moulding grades for packaging, electronics potting, textiles and general assembly.

Hot Melt Adhesive Benefits

Sets in Seconds

Near-instant bond strength on cooling speeds up production.

Solvent-Free

No VOCs, water or curing time — clean and consistent.

Bonds Many Materials

Adheres to plastics, paper, wood, textiles and metals.

Low-Pressure Moulding

Protective over-moulding for cables, connectors and electronics.

Hot Melt Range

General-Purpose Hot Melts

Versatile grades for packaging and assembly bonding.

Low-Pressure Moulding Grades

Encapsulate and strain-relieve electronics and connectors.

High-Performance Hot Melts

Improved heat and bond strength for demanding assembly.

Hot Melt Applications

Frequently Asked Questions

A hot melt adhesive is a solid thermoplastic that is melted and applied hot, then bonds rapidly as it cools and solidifies, with no solvents or curing time.

Low-pressure moulding uses a hot melt to over-mould and seal electronics at low pressure, protecting connectors and cables from moisture and strain.

Hot melts bond plastics, paper, card, wood, textiles and some metals, making them very versatile for assembly and packaging.

Speed Up High-Volume Assembly

Send us your substrate, operating environment and volume — our engineers will recommend a solution and send a free sample and quote.